Chip-to-chip optical interconnections between stacked self-aligned SOI photonic chips.

Photonic silicon devices are key enabling technologies for next generation High Performance Computers. In this paper, we report the possibility to stack and optically interconnect SOI based photonic chips for future System-In-Package photonic architecture. Combining vertical grating couplers and state-of-the-art flip-chip technology, we demonstrated low loss penalties and wide spectral range optical interconnections between stacked photonic chips.