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一款带有小型化密封封装的232通道视网膜视觉假体。

A 232-channel retinal vision prosthesis with a miniaturized hermetic package.

作者信息

Ordonez Juan S, Schuettler Martin, Ortmanns Maurits, Stieglitz Thomas

机构信息

Laboratory for Biomedical Microtechnology, Dept. of Microsystems Engineering-IMTEK, Univ. of Freiburg, Germany.

出版信息

Annu Int Conf IEEE Eng Med Biol Soc. 2012;2012:2796-9. doi: 10.1109/EMBC.2012.6346545.

Abstract

Miniaturization of implantable devices while drastically increasing the number of stimulation channels is one of the greatest challenges in implant manufacturing because a small but hermetic package is needed that provides reliable protection for the electronics over decades. Retinal vision prostheses are the best example for it. This paper presents a miniaturized 232-channel vision prosthesis, summarizing the studies on the individual technologies that were developed, improved and combined to fabricate a telemetrically powered retinal device sample. The implantable unit, which is made out of a high temperature co-fired alumina ceramic package containing hermetic feedthroughs, electronic circuitry and a radio frequency coil for powering is manufactured through a modified screen-printing/lasering process. The package is sealed with solder glass to provide unaffected inductive coupling to the telemetric transmitter. A 0.05 cc inner volume allows helium leak testing and mathematical lifetime estimations for moisture-induced failure of up to 100 years. The feedthroughs contact a thin-film polyimide electrode array that utilizes DLC and SiC coatings for improved interlayer adhesion of the metallic tracks to the polymer carrier. Two metal layers allow integrated wiring of the electrode array within the very limited space.

摘要

在大幅增加刺激通道数量的同时实现植入式设备的小型化,是植入物制造中最大的挑战之一,因为需要一个小巧但密封的封装,为电子设备提供数十年的可靠保护。视网膜视觉假体就是最好的例子。本文介绍了一种小型化的232通道视觉假体,总结了为制造一个遥测供电的视网膜设备样本而开发、改进和组合的各种技术的研究。可植入单元由高温共烧氧化铝陶瓷封装制成,包含密封馈通、电子电路和用于供电的射频线圈,通过改进的丝网印刷/激光工艺制造。该封装用焊料玻璃密封,以提供与遥测发射器不受影响的电感耦合。0.05立方厘米的内部体积允许进行氦气泄漏测试,并对因水分导致的故障进行长达100年的数学寿命估计。馈通与薄膜聚酰亚胺电极阵列接触,该电极阵列利用类金刚石碳(DLC)和碳化硅(SiC)涂层来改善金属迹线与聚合物载体之间的层间附着力。两层金属允许在非常有限的空间内对电极阵列进行集成布线。

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