Rojas Jhonathan P, Torres Sevilla Galo A, Hussain Muhammad M
Integrated Nanotechnology Lab, King Abdullah University of Science and Technology, Thuwal 23955-6900, Saudi Arabia.
Sci Rep. 2013;3:2609. doi: 10.1038/srep02609.
State-of-the art computers need high performance transistors, which consume ultra-low power resulting in longer battery lifetime. Billions of transistors are integrated neatly using matured silicon fabrication process to maintain the performance per cost advantage. In that context, low-cost mono-crystalline bulk silicon (100) based high performance transistors are considered as the heart of today's computers. One limitation is silicon's rigidity and brittleness. Here we show a generic batch process to convert high performance silicon electronics into flexible and semi-transparent one while retaining its performance, process compatibility, integration density and cost. We demonstrate high-k/metal gate stack based p-type metal oxide semiconductor field effect transistors on 4 inch silicon fabric released from bulk silicon (100) wafers with sub-threshold swing of 80 mV dec(-1) and on/off ratio of near 10(4) within 10% device uniformity with a minimum bending radius of 5 mm and an average transmittance of ~7% in the visible spectrum.
先进的计算机需要高性能晶体管,这些晶体管消耗超低功率,从而延长电池寿命。数十亿个晶体管通过成熟的硅制造工艺整齐地集成在一起,以保持性价比优势。在这种情况下,基于低成本单晶硅体硅(100)的高性能晶体管被视为当今计算机的核心。一个限制是硅的刚性和脆性。在这里,我们展示了一种通用的批量工艺,可将高性能硅电子产品转换为柔性且半透明的产品,同时保持其性能、工艺兼容性、集成密度和成本。我们展示了基于高k/金属栅堆叠的p型金属氧化物半导体场效应晶体管,该晶体管位于从体硅(100)晶圆上剥离的4英寸硅织物上,亚阈值摆幅为80 mV dec(-1),开/关比接近10(4),器件均匀性在10%以内,最小弯曲半径为5 mm,在可见光谱中的平均透过率约为7%。