Univ. Bordeaux, I2M, UMR 5295, F-33400 Talence, France; CNRS, I2M, UMR 5295, F-33400 Talence, France; Arts et Métiers ParisTech, I2M, UMR 5295, F-33400 Talence, France.
Ultrasonics. 2014 Sep;54(7):1760-75. doi: 10.1016/j.ultras.2014.03.002. Epub 2014 Mar 20.
Shear-Horizontally (SH) polarized, ultrasonic, guided wave modes are considered in order to infer changes in the adhesive properties at several interfaces located within an adhesive bond joining two metallic plates. Specific aluminium lap-joint samples were produced, with different adhesive properties at up to four interfaces when a glass-epoxy film is inserted into the adhesive bond. EMAT transducers were used to generate and detect the fundamental SH0 mode. This is launched from one plate and detected at the other plate, past the lap joint. Signals are picked up for different propagation paths along each sample, in order to check measurement reproducibility as well as the uniformity of the adhesively bonded zones. Signals measured for four samples are then compared, showing very good sensitivity of the SH0 mode to changes in the interfacial adhesive properties. In addition, a Finite Element-based model is used to simulate the experimental measurements. The model includes adhesive viscoelasticity, as well as spatial distributions of shear springs (with shear stiffness KT) at both metal-adhesive interfaces, and also at the adhesive-film interfaces when these are present. This model is solved in the frequency domain, but temporal excitation and inverse FFT procedure are implemented in order to simulate the measured time traces. Values of the interfacial adhesive parameters, KT, are determined by an optimization process so that best fit is obtained between both sets of measured and numerically predicted waveforms. Such agreement was also possible by adjusting the shear modulus of the adhesive component. This work suggests a promising use of SH-like guided modes for quantifying shear properties at adhesive interfaces, and shows that such waves can be used for inferring adhesive and cohesive properties of bonds separately. Finally, the paper considers improvements that could be made to the process, and its potential for testing the interfacial adhesion of adhesively bonded composite components.
研究了剪切水平(SH)偏振、超声导波模式,以便推断连接两块金属板的胶接接头内几个界面的粘结性能变化。制作了特定的铝搭接样品,当玻璃环氧薄膜插入胶接接头时,在多达四个界面处具有不同的粘结性能。电磁声换能器(EMAT)用于产生和检测基本 SH0 模式。该模式从一个板发射,并在经过搭接接头后在另一个板上检测。为了检查测量的可重复性以及胶接区域的均匀性,对每个样品的不同传播路径采集信号。然后比较四个样品的测量信号,结果表明 SH0 模式对界面粘结性能变化非常敏感。此外,使用基于有限元的模型来模拟实验测量。该模型包括粘结粘弹性,以及在金属-粘结界面处的剪切弹簧(剪切刚度 KT)的空间分布,当存在时,还包括在粘结-薄膜界面处的剪切弹簧的空间分布。该模型在频域中求解,但实施了时域激励和逆 FFT 过程,以模拟测量的时间轨迹。通过优化过程确定界面粘结参数 KT 的值,以便在两组测量和数值预测的波形之间获得最佳拟合。通过调整粘结剂成分的剪切模量也可以实现这种一致性。这项工作表明,类似 SH 的导波模式有望用于定量测量粘结界面的剪切性能,并表明这些波可用于分别推断粘结和内聚性能。最后,本文考虑了对该过程的改进及其用于测试胶接复合材料组件界面粘结的潜力。