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吸附质驱动的Cu(111)纳米凹坑表面形态变化

Adsorbate-driven morphological changes on Cu(111) nano-pits.

作者信息

Mudiyanselage K, Xu F, Hoffmann F M, Hrbek J, Waluyo I, Boscoboinik J A, Stacchiola D J

机构信息

Chemistry Department, Brookhaven National Laboratory, Upton, NY 11973, USA.

出版信息

Phys Chem Chem Phys. 2015 Feb 7;17(5):3032-8. doi: 10.1039/c4cp05088f. Epub 2014 Dec 16.

Abstract

Adsorbate-driven morphological changes of pitted-Cu(111) surfaces have been investigated following the adsorption and desorption of CO and H. The morphology of the pitted-Cu(111) surfaces, prepared by Ar(+) sputtering, exposed a few atomic layers deep nested hexagonal pits of diameters from 8 to 38 nm with steep step bundles. The roughness of pitted-Cu(111) surfaces can be healed by heating to 450-500 K in vacuum. Adsorption of CO on the pitted-Cu(111) surface leads to two infrared peaks at 2089-2090 and 2101-2105 cm(-1) for CO adsorbed on under-coordinated sites in addition to the peak at 2071 cm(-1) for CO adsorbed on atop sites of the close-packed Cu(111) surface. CO adsorbed on under-coordinated sites is thermally more stable than that of atop Cu(111) sites. Annealing of the CO-covered surface from 100 to 300 K leads to minor changes of the surface morphology. In contrast, annealing of a H covered surface to 300 K creates a smooth Cu(111) surface as deduced from infrared data of adsorbed CO and scanning tunnelling microscopy (STM) imaging. The observation of significant adsorbate-driven morphological changes with H is attributed to its stronger modification of the Cu(111) surface by the formation of a sub-surface hydride with a hexagonal structure, which relaxes into the healed Cu(111) surface upon hydrogen desorption. These morphological changes occur ∼150 K below the temperature required for healing of the pitted-Cu(111) surface by annealing in vacuum. In contrast, the adsorption of CO, which only interacts with the top-most Cu layer and desorbs by 200 K, does not significantly change the morphology of the pitted-Cu(111) surface.

摘要

在CO和H吸附与解吸之后,研究了吸附质驱动的凹坑状Cu(111)表面的形态变化。通过Ar(+)溅射制备的凹坑状Cu(111)表面的形态,呈现出一些直径为8至38 nm、具有陡峭台阶束的、深入几个原子层的嵌套六边形凹坑。凹坑状Cu(111)表面的粗糙度可通过在真空中加热至450 - 500 K来修复。CO在凹坑状Cu(111)表面的吸附,除了在密排Cu(111)表面顶位吸附的CO在2071 cm(-1)处出现的峰之外,还导致在2089 - 2090和2101 - 2105 cm(-1)处出现两个红外峰,这两个峰对应于吸附在配位不足位点上的CO。吸附在配位不足位点上的CO在热稳定性上比吸附在Cu(111)顶位上的CO更高。将覆盖有CO的表面从100 K退火至300 K会导致表面形态的微小变化。相比之下,从吸附CO的红外数据和扫描隧道显微镜(STM)成像推断,将覆盖有H的表面退火至300 K会产生一个光滑的Cu(111)表面。观察到H引起的显著的吸附质驱动的形态变化,这归因于H通过形成具有六边形结构的次表面氢化物对Cu(111)表面更强的改性作用,该氢化物在氢解吸时松弛成修复后的Cu(111)表面。这些形态变化发生的温度比通过真空退火修复凹坑状Cu(111)表面所需的温度低约150 K。相比之下,仅与最顶层Cu层相互作用且在200 K时解吸的CO吸附,不会显著改变凹坑状Cu(111)表面的形态。

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