Department of Restorative Dentistry, School of Dentistry, State University of Ponta Grossa, Paraná, Brazil; Department of Oral & Craniofacial Sciences, University of Missouri Kansas City, Kansas City, MO, USA.
Dentistry Academic Unit, Faculty of Medicine, Pontificia Universidad Católica de Chile, Santiago, Chile.
Dent Mater. 2016 Mar;32(3):468-75. doi: 10.1016/j.dental.2015.12.007. Epub 2016 Jan 13.
This study evaluated the effect of etching using 2% proanthocynidin-containing 10% phosphoric acid 2% PA/10% PhA vs. 35% phosphoric acid 35% PhA on immediate (IM) and 6-months (6M) resin-enamel microshear bond strength (μSBS), resin-dentin microtensile bond strength (μTBS), nanoleakage (NL) and as well as in situ MMP inhibition potential.
The dentin surface of human were exposed and then etched using 35% phosphoric acid for 15s or 2% PA/10% phosphoric acid for 30s. After rinsing with water, the dentin was bonded with Single Bond Plus (3M ESPE) and composite build-ups were constructed, followed by polymerization. The teeth were sectioned and the bonds were testing for microtensile bond strength (μTBS) and by SEM for NL analysis at IM and 6M. For MMP activity, resin-dentin slices were prepared for in situ zymography, and analyzed under confocal microscopy. For μSBS, others teeth had flattened enamel surfaces etched according the experimental groups and prepared to microshear procedure. The specimens were tested IM and after 6M by microshear bond strength. The data were submitted to two-way repeated measures ANOVA and Tukey's test (α=0.05).
Acid-etching using the 2% PA/10% phosphoric acid did not lower the μTBS in IM (p>0.05) compared to the control 35% phosphoric acid group. However, after 6M, only the 2% PA/10% PhA etched dentin had remained stable the resin-dentin bond strength (p<0.05). Bonds made with 35% PhA showed significant increase in NL% after 6M (p<0.05). Dentin bonds made with 2% PA/10% phosphoric acid showed no increase in NL% after 6 months. The MMP activity within the resin-dentin interface was almost completely reduced after 2% PA/10% PhA etching, while the 35% PhA exhibited intense MMP activity. For μSBS, the type of etchant and the storage period did not affect the resin-enamel bond strengths (p>0.05).
Ten percent phosphoric acid containing 2% PA can produce stable resin-dentin and enamel-resin interfaces, without requiring additional steps in the bonding procedure. Future studies for longer evaluation time are required.
本研究评估了使用 2%原花青素含 10%磷酸 2%PA/10%PhA 与 35%磷酸 35%PhA 对即刻(IM)和 6 个月(6M)树脂-牙釉质微剪切结合强度(μSBS)、树脂-牙本质微拉伸结合强度(μTBS)、纳米渗漏(NL)以及原位 MMP 抑制潜能的影响。
暴露人牙本质表面,然后用 35%磷酸酸蚀 15s 或 2%PA/10%磷酸酸蚀 30s。水冲洗后,用单键 Plus(3M ESPE)粘结牙本质,构建复合层,然后聚合。牙齿被切割,用微拉伸结合强度(μTBS)和 SEM 进行纳米渗漏(NL)分析,在即刻和 6M 时进行检测。对于 MMP 活性,制备树脂-牙本质切片进行原位酶谱分析,并在共聚焦显微镜下进行分析。对于 μSBS,其他牙齿根据实验组的要求将牙釉质表面磨平,然后进行微剪切程序。标本在即刻和 6M 后通过微剪切结合强度进行测试。数据采用双因素重复测量方差分析和 Tukey 检验(α=0.05)。
与对照组 35%磷酸组相比,使用 2%PA/10%磷酸酸蚀不会降低即刻时的 μTBS(p>0.05)。然而,6 个月后,只有 2%PA/10%PhA 酸蚀牙本质保持了稳定的树脂-牙本质结合强度(p<0.05)。6 个月后,用 35%PhA 处理的牙本质粘结剂的 NL%显著增加(p<0.05)。用 2%PA/10%磷酸酸蚀处理的牙本质粘结剂在 6 个月后没有增加 NL%。用 2%PA/10%磷酸酸蚀处理后,树脂-牙本质界面内的 MMP 活性几乎完全降低,而 35%磷酸组则表现出强烈的 MMP 活性。对于 μSBS,蚀刻剂的类型和储存时间均不影响树脂-牙釉质的粘结强度(p>0.05)。
含有 10%磷酸的 2%PA 可产生稳定的树脂-牙本质和牙釉质-树脂界面,无需在粘结程序中增加额外步骤。需要进行更长时间评估的进一步研究。