Centre for Energy Research, Institute of Technical Physics and Materials Science, 2D Nanoelectronics "Lendület" Research Group, Budapest, Hungary.
Korea Research Institute of Standards and Science, Center for Nanometrology, Daejeon, South Korea.
Sci Rep. 2016 Jul 22;6:29726. doi: 10.1038/srep29726.
MoS2 single layers have recently emerged as strong competitors of graphene in electronic and optoelectronic device applications due to their intrinsic direct bandgap. However, transport measurements reveal the crucial role of defect-induced electronic states, pointing out the fundamental importance of characterizing their intrinsic defect structure. Transmission Electron Microscopy (TEM) is able to image atomic scale defects in MoS2 single layers, but the imaged defect structure is far from the one probed in the electronic devices, as the defect density and distribution are substantially altered during the TEM imaging. Here, we report that under special imaging conditions, STM measurements can fully resolve the native atomic scale defect structure of MoS2 single layers. Our STM investigations clearly resolve a high intrinsic concentration of individual sulfur atom vacancies, and experimentally identify the nature of the defect induced electronic mid-gap states, by combining topographic STM images with ab intio calculations. Experimental data on the intrinsic defect structure and the associated defect-bound electronic states that can be directly used for the interpretation of transport measurements are essential to fully understand the operation, reliability and performance limitations of realistic electronic devices based on MoS2 single layers.
二硫化钼(MoS2)单层材料由于其本征直接带隙,最近已成为电子和光电子器件应用中石墨烯的有力竞争者。然而,输运测量揭示了缺陷诱导的电子态的关键作用,指出了表征其本征缺陷结构的基本重要性。透射电子显微镜(TEM)能够对 MoS2 单层材料中的原子尺度缺陷进行成像,但所成像的缺陷结构与电子器件中探测到的缺陷结构相差甚远,因为在 TEM 成像过程中,缺陷密度和分布发生了实质性的变化。在这里,我们报告说,在特殊的成像条件下,STM 测量可以完全解析 MoS2 单层材料的本征原子尺度缺陷结构。我们的 STM 研究清楚地解析了单个硫原子空位的高本征浓度,并通过将形貌 STM 图像与第一性原理计算相结合,实验确定了缺陷诱导的电子带隙中间态的性质。直接用于解释输运测量的本征缺陷结构和相关缺陷束缚电子态的实验数据对于充分理解基于 MoS2 单层材料的实际电子设备的工作原理、可靠性和性能限制至关重要。