Novais Veridiana Resende, Raposo Luís Henrique Araújo, Miranda Rafael Resende de, Lopes Camila de Carvalho Almança, Simamoto Paulo Cézar, Soares Carlos José
Universidade Federal de Uberlândia, Faculdade de Odontologia, Departamento de Dentística e Materiais Odontológicos, Uberlândia, MG, Brasil.
Universidade Federal de Uberlândia, Faculdade de Odontologia, Departamento de Oclusão, Prótese Fixa e Materiais Odontológicos, Uberlândia, MG, Brasil.
J Appl Oral Sci. 2017 Jan-Feb;25(1):61-68. doi: 10.1590/1678-77572016-0221.
The aim of this study was to assess the performance of resin cements when different curing modes are used, by evaluating the degree of conversion and bond strength to a ceramic substrate.
Three resin cements were evaluated, two dual-cured (Variolink II and RelyX ARC) and one light-cured (Variolink Veneer). The dual-cured resin cements were tested by using the dual activation mode (base and catalyst) and light-activation mode (base paste only). For degree of conversion (DC) (n=5), a 1.0 mm thick feldspathic ceramic disc was placed over the resin cement specimens and the set was light activated with a QTH unit. After 24 h storage, the DC was measured with Fourier transform infrared spectroscopy (FTIR). For microshear bond strength testing, five feldspathic ceramic discs were submitted to surface treatment, and three cylindrical resin cement specimens were bonded to each ceramic surface according to the experimental groups. After 24 h, microshear bond testing was performed at 0.5 mm/min crosshead speed until the failure. Data were submitted to one-way ANOVA followed by Tukey test (p<0.05). Scanning electron microscopy (SEM) was used for classifying the failure modes.
Higher DC and bond strength values were shown by the resin cements cured by using the dual activation mode. The Variolink II group presented higher DC and bond strength values when using light-activation only when compared with the Variolink Veneer group.
The base paste of dual-cured resin cements in light-activation mode can be used for bonding translucent ceramic restorations of up to or less than 1.0 mm thick.
本研究旨在通过评估转化率和与陶瓷基底的粘结强度,来评价使用不同固化模式时树脂水门汀的性能。
评估了三种树脂水门汀,两种双重固化型(Variolink II和RelyX ARC)和一种光固化型(Variolink Veneer)。双重固化树脂水门汀通过双重激活模式(基质和催化剂)和光激活模式(仅基质糊剂)进行测试。对于转化率(DC)(n = 5),将一块1.0毫米厚的长石质陶瓷盘置于树脂水门汀试件上,并用石英卤钨灯装置进行光激活固化。储存24小时后,用傅里叶变换红外光谱(FTIR)测量DC。对于微剪切粘结强度测试,对五块长石质陶瓷盘进行表面处理,并根据实验组将三个圆柱形树脂水门汀试件粘结到每个陶瓷表面。24小时后,以0.5毫米/分钟的十字头速度进行微剪切粘结测试,直至破坏。数据采用单因素方差分析,随后进行Tukey检验(p < 0.05)。使用扫描电子显微镜(SEM)对破坏模式进行分类。
采用双重激活模式固化的树脂水门汀显示出更高的DC和粘结强度值。仅在光激活模式下,与Variolink Veneer组相比,Variolink II组呈现出更高的DC和粘结强度值。
双重固化树脂水门汀的基质糊剂在光激活模式下可用于粘结厚度达或小于1.0毫米的半透明陶瓷修复体。