Department of Mechanical and Aerospace Engineering and ‡School of Engineering and Applied Science, Princeton University , Princeton, New Jersey 08544-5263, United States.
Langmuir. 2017 Sep 19;33(37):9479-9489. doi: 10.1021/acs.langmuir.7b00668. Epub 2017 Jun 6.
Knowledge of a semiconductor electrode's band edge alignment is essential for optimizing processes that occur at the semiconductor/electrolyte interface. Photocatalytic processes are particularly sensitive to such alignments, as they govern the transfer of photoexcited electrons or holes from the surface to reactants in the electrolyte solution. Reconstructions of a semiconductor surface during operation, as well as its interaction with the electrolyte solution, must be considered when determining band edge alignment. Here, we employ density functional theory + U theory to assess the stability of reconstructed CuInS surfaces, a system which has shown promise for the active and selective photoelectrocatalytic reduction of CO to CHOH. Using many-body Green's function theory combined with calculations of surface work functions, we determine band edge positions of explicitly solvated, reconstructed CuInS surfaces. We find that there is a linear relationship between band edge position and net surface dipole, with the most stable solvent/surface structures tending to minimize this dipole because of generally weak interactions between the surface and solvating water molecules. We predict a conduction band minimum (CBM) of the solvated, reconstructed CuInS surface of -2.44 eV vs vacuum at the zero-dipole intercept of the dipole/CBM trendline, in reasonable agreement with the experimentally reported CBM position at -2.64 eV vs vacuum. This methodology offers a simplified approach for approximating the band edge positions at complex semiconductor/electrolyte interfaces.
了解半导体电极的能带边缘排列对于优化在半导体/电解质界面发生的过程至关重要。光催化过程对这种排列特别敏感,因为它们控制着从表面到电解质溶液中反应物的光激发电子或空穴的转移。在确定能带边缘排列时,必须考虑半导体表面在操作过程中的重构以及与电解质溶液的相互作用。在这里,我们使用密度泛函理论+ U 理论来评估 CuInS 表面重构的稳定性,该体系在 CO 到 CHOH 的光电催化还原方面表现出了很高的活性和选择性。我们使用多体格林函数理论结合表面功函数的计算,确定了明确溶剂化的、重构的 CuInS 表面的能带边缘位置。我们发现,能带边缘位置与净表面偶极子之间存在线性关系,最稳定的溶剂/表面结构由于表面和溶剂化水分子之间的一般较弱相互作用而倾向于最小化这种偶极子。我们预测溶剂化、重构的 CuInS 表面的导带底(CBM)在零偶极子截距处相对于真空为-2.44 eV,与实验报告的相对于真空的 CBM 位置-2.64 eV 相比,处于合理的一致性。这种方法为近似复杂半导体/电解质界面的能带边缘位置提供了一种简化方法。