Department of Physical Metallurgy and Materials Testing, Montanuniversität Leoben, Franz-Josef-Strasse 18, 8700, Leoben, Austria.
Materials Chemistry, RWTH Aachen University, Kopernikusstrasse 10, 52074, Aachen, Germany.
Sci Rep. 2017 Aug 7;7(1):7374. doi: 10.1038/s41598-017-07825-1.
A major obstacle in the utilization of Mo thin films in flexible electronics is their brittle fracture behavior. Within this study, alloying with Re is explored as a potential strategy to improve the resistance to fracture. The sputter-deposited MoRe films (with 0 ≤ x ≤ 0.31) were characterized in terms of structural and mechanical properties, residual stresses as well as electrical resistivity. Their deformation behavior was assessed by straining 50 nm thin films on polyimide substrates in uniaxial tension, while monitoring crack initiation and propagation in situ by optical microscopy and electrical resistance measurements. A significant toughness enhancement occurs with increasing Re content for all body-centered cubic solid solution films (x ≤ 0.23). However, at higher Re concentrations (x > 0.23) the positive effect of Re is inhibited due to the formation of dual-phase films with the additional close packed A15 MoRe phase. The mechanisms responsible for the observed toughness behavior are discussed based on experimental observations and electronic structure calculations. Re gives rise to both increased plasticity and bond strengthening in these Mo-Re solid solutions.
在柔性电子学中应用 Mo 薄膜的一个主要障碍是其脆性断裂行为。在本研究中，探索了与 Re 合金化作为提高抗断裂能力的一种潜在策略。通过溅射沉积制备了 MoRe 薄膜（0≤x≤0.31），并对其结构和力学性能、残余应力以及电阻率进行了表征。通过在聚酰亚胺衬底上单向拉伸 50nm 厚的薄膜，原位监测光学显微镜和电阻测量中的裂纹起始和扩展，评估了它们的变形行为。对于所有体心立方固溶体薄膜（x≤0.23），随着 Re 含量的增加，韧性显著增强。然而，在更高的 Re 浓度（x>0.23）下，由于形成了具有附加密排 A15 MoRe 相的双相薄膜，Re 的积极作用受到抑制。根据实验观察和电子结构计算讨论了导致观察到的韧性行为的机制。Re 在这些 Mo-Re 固溶体中既增加了塑性，又增强了键合。
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