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基于热线索的材料识别:机制与应用

Material recognition based on thermal cues: Mechanisms and applications.

作者信息

Ho Hsin-Ni

机构信息

NTT Communication Science Laboratoires, Nippon Telegraph and Telephone Corporation, Atsugi, Kanagawa, Japan.

出版信息

Temperature (Austin). 2017 Nov 10;5(1):36-55. doi: 10.1080/23328940.2017.1372042. eCollection 2018.

Abstract

Some materials feel colder to the touch than others, and we can use this difference in perceived coldness for material recognition. This review focuses on the mechanisms underlying material recognition based on thermal cues. It provides an overview of the physical, perceptual, and cognitive processes involved in material recognition. It also describes engineering domains in which material recognition based on thermal cues have been applied. This includes haptic interfaces that seek to reproduce the sensations associated with contact in virtual environments and tactile sensors aim for automatic material recognition. The review concludes by considering the contributions of this line of research in both science and engineering.

摘要

有些材料摸起来比其他材料更冷,我们可以利用这种感知到的冷感差异来识别材料。本综述重点关注基于热线索的材料识别背后的机制。它概述了材料识别中涉及的物理、感知和认知过程。它还描述了已应用基于热线索的材料识别的工程领域。这包括旨在在虚拟环境中重现与接触相关感觉的触觉界面,以及旨在实现自动材料识别的触觉传感器。综述最后考虑了这一研究方向在科学和工程方面的贡献。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/8649/5902225/7d18b067978b/ktmp-05-01-1372042-g002.jpg

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