Gao Yajun, Liu Jiang, Isikgor Furkan H, Wang Mingcong, Khan Jafar I, De Wolf Stefaan, Laquai Frédéric
KAUST Solar Center (KSC), Physical Sciences and Engineering Division (PSE), Materials Science and Engineering Program (MSE), King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Kingdom of Saudi Arabia.
ACS Appl Mater Interfaces. 2022 Aug 3;14(30):34281-34290. doi: 10.1021/acsami.2c03016. Epub 2022 May 13.
Interfaces in metal halide perovskite (MHP) solar cells cause carrier recombination and thereby reduce their power conversion efficiency. Here, ultrafast (picosecond to nanosecond) transient reflection (TR) spectroscopy has been used to probe interfacial carrier dynamics in thin films of the reference MHP MAPbI and state-of-the-art (CsMAFA)Pb(BrI) (CsFAMA). First, MAPbI films in contact with fullerene-based charge extraction layers (CTLs) in the presence and absence of LiF used as an interlayer (ITL) were studied. To quantify and discriminate between interface-induced and bulk carrier recombination, we employed a one-dimensional diffusion and recombination model. The interface-induced carrier recombination velocity was found to be 1229 ± 78 cm s in nonpassivated MAPbI films, which was increased to 2248 ± 75 cm s when MAPbI interfaced directly with C, whereas it was reduced to 145 ± 63 cm s when inserting a 1 nm thin LiF interlayer between MAPbI and C, in turn improving the open-circuit voltage of devices by 33 mV. Second, the effect of surface and grain boundary passivation by PhenHCl in CsFAMA was revealed. Here, the recombination velocity decreased from 605 ± 52 to 0.16 ± 5.28 and 7.294 ± 34.5 cm s, respectively. The approach and data analysis presented here are immediately applicable to other perovskite/interlayer/CTL interfaces and passivation protocols, and they add to our understanding of the impact of surfaces and interfaces in MHP-based thin films on carrier recombination and device efficiency.
金属卤化物钙钛矿(MHP)太阳能电池中的界面会导致载流子复合,从而降低其功率转换效率。在此,超快(皮秒到纳秒)瞬态反射(TR)光谱已被用于探测参考MHP MAPbI和最先进的(CsMAFA)Pb(BrI)(CsFAMA)薄膜中的界面载流子动力学。首先,研究了在有和没有用作中间层(ITL)的LiF的情况下,与基于富勒烯的电荷提取层(CTL)接触的MAPbI薄膜。为了量化和区分界面诱导的和体载流子复合,我们采用了一维扩散和复合模型。发现在未钝化的MAPbI薄膜中,界面诱导的载流子复合速度为1229±78 cm/s,当MAPbI直接与C接触时,该速度增加到2248±75 cm/s,而当在MAPbI和C之间插入1 nm厚的LiF中间层时,该速度降低到145±63 cm/s,进而使器件的开路电压提高了33 mV。其次,揭示了PhenHCl对CsFAMA表面和晶界的钝化作用。在此,复合速度分别从605±52降低到0.16±5.28和7.294±34.5 cm/s。本文提出的方法和数据分析可立即应用于其他钙钛矿/中间层/CTL界面和钝化协议,并且它们增进了我们对基于MHP的薄膜中表面和界面在载流子复合和器件效率方面影响的理解。