Mori Takashige, Amino Takafumi, Yokoyama Chie, Taniguchi Shunsuke, Yonezawa Takayuki, Taniyama Akira
Research & Development, Nippon Steel Corporation, 1-8 Fuso-Cho, Amagasaki, Hyogo 660-0891, Japan.
Research & Development, Nippon Steel Corporation, 20-1 Shintomi, Futtsu, Chiba 293-8511, Japan.
Microscopy (Oxf). 2024 Jul 30;73(4):308-317. doi: 10.1093/jmicro/dfad061.
Electron channeling contrast imaging (ECCI) was applied by precisely controlling the primary electron beam incident direction of the crystal plane in scanning electron microscope (SEM), and the dislocation contrast in steel materials was investigated in detail via SEM/ECCI. The dislocation contrast was observed near a channeling condition, where the incident electron beam direction of the crystal plane varied, and the backscattered electron intensity reached a local minimum. Comparing the dislocation contrasts in the visualized electron channeling contrast (ECC) images and transmission electron microscope (TEM) images, the positions of all dislocation lines were coincident. During the SEM/ECCI observation, the dislocation contrast varied depending on the incident electron beam direction of the crystal plane and accelerating voltages, and optimal conditions existed. When the diffraction condition g and the Burgers vector b of dislocation satisfied the condition g⸱b = 0, the screw dislocation contrast in the ECC image disappeared. An edge dislocation line was wider than a screw dislocation line. Thus, the SEM/ECCI method can be used for dislocation characterization and the strain field evaluation around dislocation, like the TEM method. The depth information of SEM/ECCI, where the channeling condition is strictly satisfied, can be obtained from dislocation contrast deeper than 5ξg, typically used for depth of SEM/ECCI.
通过在扫描电子显微镜(SEM)中精确控制晶体平面的一次电子束入射方向来应用电子通道衬度成像(ECCI),并通过SEM/ECCI详细研究了钢铁材料中的位错衬度。在位错通道条件附近观察到位错衬度,此时晶体平面的入射电子束方向发生变化,背散射电子强度达到局部最小值。比较可视化电子通道衬度(ECC)图像和透射电子显微镜(TEM)图像中的位错衬度,所有位错线的位置是重合的。在SEM/ECCI观察过程中,位错衬度随晶体平面的入射电子束方向和加速电压而变化,并且存在最佳条件。当位错的衍射条件g和柏氏矢量b满足条件g⸱b = 0时,ECC图像中的螺型位错衬度消失。刃型位错线比螺型位错线宽。因此,SEM/ECCI方法可用于位错表征和位错周围应变场评估,类似于TEM方法。SEM/ECCI的深度信息,即严格满足通道条件的深度信息,可以从比5ξg更深的位错衬度中获得,5ξg通常用于SEM/ECCI的深度。