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基于管状石墨烯/III-V族半导体异质结构和共面三电极的3D组装双模光电探测器的演示。

Demonstration of a 3D-Assembled Dual-Mode Photodetector Based on Tubular Graphene/III-V Semiconductors Heterostructure and Coplanar Three Electrodes.

作者信息

Xu Jiyu, Wang Qi, Shen Mingyang, Yang Yubo, Liu Hao, Yuan Xueguang, Zhang Yangan, Liu Kai, Cai Shiwei, Huang Yongqing, Ren Xiaomin

机构信息

State Key Laboratory of Information Photonics and Optical Communications, Beijing University of Posts and Telecommunications, Beijing 100876, People's Republic of China.

School of Electronic Engineering, Beijing University of Posts and Telecommunications, Beijing 100876, People's Republic of China.

出版信息

ACS Nano. 2024 Jun 11;18(23):14978-14988. doi: 10.1021/acsnano.4c00839. Epub 2024 May 28.

Abstract

3D assembly technology is a cutting-edge methodology for constructing high-performance and multifunctional photodetectors since some attractive photodetection features such as light trapping effect, omnidirectional ability, and high spatial resolution can be introduced. However, there has not been any report of 3D-assembled multimode photodetectors owing to the lack of design and fabrication guideline of electrodes serving for 3D heterostructures. In this study, a 3D-assembled dual-mode photodetector (3DdmPD) was realized successfully via the clever electrical contact between the rolled-up tubular graphene/GaAs/InGaAs heterostructure and planar metal electrode. Arbitrary switching of three coplanar electrodes makes the as-fabricated tubular 3D photodetector work at the unbiased photodiode mode, which is suitable for energy conservation high-speed photodetection, or the biased photoconductive mode, which favors extremely weak light photodetection, fully showing the advantages of multifunctional detection. In more detail, the / ratio reached as high as 2 × 10, and a responsivity of 42.3 mA/W, a detectivity of 1.5 × 10 Jones, as well as a rising/falling time (τ/τ) of 360/370 μs were achieved under the self-driven photodiode mode. Excitingly, 3DdmPD shows omnidirectional photodetection ability at the same time. When 3DdmPD works at the photoconductive mode with 5 V bias, its responsivity is extremely high as 7.9 × 10 A/W and corresponding detectivity is increased to 1.0 × 10 Jones. Benefiting from the totally independent coplanar electrodes, 3DdmPD is much more easily integrated as arrays that are expected to offer the function of high-speed omnidirectional image-sensing with ultralow power consumption than the planar counterparts which share communal bottom electrodes. We believe that our work can contribute to the progress of 3D-assembled optoelectronic devices.

摘要

3D组装技术是构建高性能和多功能光电探测器的前沿方法,因为它可以引入一些吸引人的光电探测特性,如光捕获效应、全向能力和高空间分辨率。然而,由于缺乏用于3D异质结构的电极的设计和制造指南,尚未有关于3D组装多模光电探测器的报道。在本研究中,通过卷绕管状石墨烯/GaAs/InGaAs异质结构与平面金属电极之间巧妙的电接触,成功实现了3D组装双模光电探测器(3DdmPD)。三个共面电极的任意切换使得所制备的管状3D光电探测器能够在无偏置光电二极管模式下工作,该模式适用于节能高速光电探测,或者在有偏置的光电导模式下工作,该模式有利于极微弱光的光电探测,充分展现了多功能探测的优势。更详细地说,在自驱动光电二极管模式下,/比高达2×10,响应度为42.3 mA/W,探测率为1.5××10琼斯,上升/下降时间(τ/τ)为360/370 μs。令人兴奋的是,3DdmPD同时还具有全向光电探测能力。当3DdmPD在5 V偏置下工作于光电导模式时,其响应度极高,达到7.9×10 A/W,相应的探测率提高到1.0×10琼斯。受益于完全独立的共面电极,3DdmPD比共享公共底部电极的平面同类器件更容易集成成阵列,有望提供具有超低功耗的高速全向图像传感功能。我们相信我们的工作能够推动3D组装光电器件的发展。

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