Lin Chia-Feng, Huang Kun-Pin, Wang Han-Wei, Chen Kuei-Ting, Wang Cheng-Jie, Kao Yu-Cheng, Chen Hsiang, Lin Yung-Sen
Department of Materials Science and Engineering, National Chung Hsing University, Taichung 402202, Taiwan.
Department of Applied Materials and Optoelectronic Engineering, National Chi Nan University, Nantou 54561, Taiwan.
ACS Omega. 2024 May 28;9(23):25277-25282. doi: 10.1021/acsomega.4c03082. eCollection 2024 Jun 11.
High channel current of the high electron mobility transistors (HEMTs) and high relative responsivity of the photodetectors (PDs) were demonstrated in the AlGaN/AlN/GaN channel-stacking epitaxial structures. The interference properties of the X-ray curves indicated high-quality interfaces of the conductive channels. The AlGaN/AlN/GaN interfaces were observed clearly in the transmission electron microscope micrograph. The saturation currents of the HEMT structures were increased by adding a number of channels. The conductive properties of the channel-stacking structures corresponded to the peaks of the transconductance ( ) spectra in the HEMT structures. The depletion-mode one- and two-channel HEMT structures can be operated at the cutoff region by increasing the reverse bias voltages. Higher current in the active state and lower current in the cutoff state were observed in the two-channel HEMT structure compared with one- and three-channel HEMT structures. For the channel-stacking metal-semiconductor-metal photodetector structures, the peak responsivity was observed at almost 300 nm incident monochromic light, which was increased by adding a number of channel layers. The channel current of the HEMT devices and the photocurrent in the PD devices were increased by adding a number of two-dimensional electron gas (2DEG) channels. By using a flat gate metal layer, the two-channel AlGaN/AlN/GaN HEMT structures exhibited a high current, a low cutoff current, and a high peak value and have the potential for GaN-based power devices, fast portable chargers, and ultraviolet PD applications.
在AlGaN/AlN/GaN沟道堆叠外延结构中展示了高电子迁移率晶体管(HEMT)的高沟道电流和光电探测器(PD)的高相对响应度。X射线曲线的干涉特性表明导电沟道具有高质量的界面。在透射电子显微镜显微照片中清晰地观察到了AlGaN/AlN/GaN界面。通过增加沟道数量,HEMT结构的饱和电流得到了提高。沟道堆叠结构的导电特性与HEMT结构中跨导( )谱的峰值相对应。通过增加反向偏置电压,耗尽型单沟道和双沟道HEMT结构可以在截止区工作。与单沟道和三沟道HEMT结构相比,在双沟道HEMT结构中观察到了有源状态下更高的 电流和截止状态下更低的电流。对于沟道堆叠金属-半导体-金属光电探测器结构,在近300 nm的入射单色光下观察到了峰值响应度,通过增加沟道层数量该响应度得到了提高。通过增加二维电子气(2DEG)沟道的数量,HEMT器件的沟道电流和PD器件中的光电流都增加了。通过使用平面栅极金属层,双沟道AlGaN/AlN/GaN HEMT结构表现出高 电流、低截止电流和高的峰值 值,并且在基于GaN的功率器件、快速便携式充电器和紫外PD应用方面具有潜力。