Cui Jingjing, Xie Chenghao, Hu Weiwei, Luo Hao, Mei Qicai, Li Songlin, Xu Weibin, Gao Zhibin, Wu Jinsong, Zhang Qingjie, Tang Xinfeng, Tan Gangjian
State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan, Hubei 430070, People's Republic of China.
International School of Materials Science and Engineering, Wuhan University of Technology, Wuhan, Hubei 430070, People's Republic of China.
ACS Appl Mater Interfaces. 2024 Jul 31;16(30):39656-39663. doi: 10.1021/acsami.4c08186. Epub 2024 Jul 20.
The coupling of charge and phonon transport in solids is a long-standing issue for thermoelectric performance enhancement. Herein, two new narrow-gap semiconductors with the same chemical formula of GeSeTe (GST) are rationally designed and synthesized: one with a layered hexagonal structure (H-GST) and the other with a non-layered rhombohedral structure (R-GST). Thanks to the three-dimensional (3D) network structure, R-GST possesses a significantly larger weighted mobility than H-GST. Surprisingly, 3D-structured R-GST displays an extremely low lattice thermal conductivity of ∼0.5 W m K at 523 K, which is comparable to that of layered H-GST. The two-dimensional (2D)-like phonon transport in R-GST stems from the unique off-centering Ge atoms that induce ferroelectric instability, yielding soft polar phonons, as demonstrated by the Boson peak detected by the low-temperature specific heat and calculated phonon spectra. Furthermore, 1 mol % doping of Sb is utilized to successfully suppress the undesired phase transition of R-GST toward H-GST at elevated temperatures. Consequently, a peak of 1.1 at 623 K is attained in the rhombohedral GeSbSeTe sample, which is 1 order of magnitude larger than that of GeSe. This work demonstrates the feasibility of exploring high-performance thermoelectric materials with decoupled charge and phonon transport in off-centering compounds.
固体中电荷与声子输运的耦合是提高热电性能的一个长期存在的问题。在此,合理设计并合成了两种具有相同化学式GeSeTe(GST)的新型窄带隙半导体:一种具有层状六方结构(H-GST),另一种具有非层状菱面体结构(R-GST)。得益于三维(3D)网络结构,R-GST具有比H-GST大得多的加权迁移率。令人惊讶的是,3D结构的R-GST在523 K时显示出极低的晶格热导率,约为0.5 W m⁻¹ K⁻¹,这与层状H-GST相当。R-GST中类似二维(2D)的声子输运源于独特的非中心Ge原子,这些原子诱导铁电不稳定性,产生软极性声子,低温比热检测到的玻色子峰和计算得到的声子谱证明了这一点。此外,利用1 mol%的Sb掺杂成功抑制了R-GST在高温下向H-GST的不期望的相变。因此,菱面体GeSbSeTe样品在623 K时达到了1.1的峰值,比GeSe的峰值大一个数量级。这项工作证明了在非中心化合物中探索电荷与声子输运解耦的高性能热电材料的可行性。