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基于湿法蚀刻工艺制备的双端支撑弹性基板的电气和机械性能研究。

Study on Electrical and Mechanical Properties of Double-End Supported Elastic Substrate Prepared by Wet Etching Process.

作者信息

Song Ding, Wu Wenge

机构信息

School of Mechanical Engineering, North University of China, Taiyuan 030051, China.

出版信息

Micromachines (Basel). 2024 Jul 20;15(7):929. doi: 10.3390/mi15070929.

Abstract

Preparing elastic substrates as a carrier for dual-end supported nickel chromium thin film strain sensors is crucial. Wet etching is a vital microfabrication process widely used in producing microelectronic components for various applications. This article combines lithography and wet etching methods to microprocess the external dimensions and rectangular grooves of 304 stainless steel substrates. The single-factor variable method was used to explore the influence mechanism of FeCl, HCl, HNO, and temperature on the etching rate, etching factor, and etching surface roughness. The optimal etching parameter combination was summarized: an FeCl concentration of 350 g/L, HCl concentration of 150 mL/L, HNO concentration of 100 mL/L, and temperature of 40 °C. In addition, by comparing the surface morphology, microstructure, and chemical and mechanical properties of a 304 stainless steel substrate before and after etching treatment, it can be seen that the height difference of the substrate surface before and after etching is between 160 μm and -70 μm, which is basically consistent with the initial design of 0.2 mm. The results of an XPS analysis and Raman spectroscopy analysis both indicate that the surface C content increases after etching, and the corrosion resistance of the surface after etching decreases. The nano-hardness after etching increased by 26.4% compared to before, and the value decreased by 7%. The combined XPS and Raman results indicate that the changes in surface mechanical properties of 304 stainless steel substrates after etching are mainly caused by the formation of micro-nanostructures, grain boundary density, and dislocations after wet etching. Compared with the initial rectangular substrate, the strain of the I-shaped substrate after wet etching increased by 3.5-4 times. The results of this study provide the preliminary process parameters for the wet etching of a 304 stainless steel substrate of a strain measuring force sensor and have certain guiding significance for the realization of simple steps and low cost of 304 stainless steel substrate micro-nano-processing.

摘要

制备弹性基板作为双端支撑镍铬薄膜应变传感器的载体至关重要。湿法蚀刻是一种重要的微加工工艺,广泛应用于生产各种应用的微电子元件。本文结合光刻和湿法蚀刻方法对304不锈钢基板的外部尺寸和矩形凹槽进行微加工。采用单因素变量法探究FeCl、HCl、HNO和温度对蚀刻速率、蚀刻因子和蚀刻表面粗糙度的影响机制。总结出最佳蚀刻参数组合:FeCl浓度为350 g/L、HCl浓度为150 mL/L、HNO浓度为100 mL/L、温度为40℃。此外,通过比较蚀刻处理前后304不锈钢基板的表面形貌、微观结构以及化学和力学性能,可见蚀刻前后基板表面的高度差在160μm至 -70μm之间,与初始设计的0.2mm基本一致。XPS分析和拉曼光谱分析结果均表明,蚀刻后表面C含量增加,蚀刻后表面的耐腐蚀性降低。蚀刻后的纳米硬度比蚀刻前提高了26.4%, 值降低了7%。XPS和拉曼结果相结合表明,304不锈钢基板蚀刻后表面力学性能的变化主要是由湿法蚀刻后形成的微纳米结构、晶界密度和位错引起的。与初始矩形基板相比,湿法蚀刻后I形基板的应变增加了3.5 - 4倍。本研究结果为应变测量力传感器的304不锈钢基板湿法蚀刻提供了初步工艺参数,对实现304不锈钢基板微纳加工的步骤简单化和低成本具有一定的指导意义。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d0bd/11279102/db89d36d8ee4/micromachines-15-00929-g001.jpg

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