软传感回归模型:从传感器到晶圆计量预测
Soft-Sensing Regression Model: From Sensor to Wafer Metrology Forecasting.
作者信息
Fan Angzhi, Huang Yu, Xu Fei, Bom Sthitie
机构信息
Department of Statistics, University of Chicago, Chicago, IL 60637, USA.
Seagate Technology, Fremont, CA 94538, USA.
出版信息
Sensors (Basel). 2023 Oct 10;23(20):8363. doi: 10.3390/s23208363.
The semiconductor industry is one of the most technology-evolving and capital-intensive market sectors. Effective inspection and metrology are necessary to improve product yield, increase product quality and reduce costs. In recent years, many types of semiconductor manufacturing equipments have been equipped with sensors to facilitate real-time monitoring of the production processes. These production-state and equipment-state sensor data provide an opportunity to practice machine-learning technologies in various domains, such as anomaly/fault detection, maintenance scheduling, quality prediction, etc. In this work, we focus on the soft-sensing regression problem in metrology systems, which uses sensor data collected during wafer processing steps to predict impending inspection measurements that used to be measured in wafer inspection and metrology systems. We proposed a regressor based on Long Short-term Memory network and devised two distinct loss functions for the purpose of the training model. Although the assessment of our prediction errors by engineers is subjective, a novel piece-wise evaluation metric was introduced to evaluate model accuracy in a mathematical way. Our experimental results showcased that the proposed model is capable of achieving both accurate and early prediction across various types of inspections in complicated manufacturing processes.
半导体行业是技术发展最为迅速且资本密集度最高的市场领域之一。有效的检测和计量对于提高产品良率、提升产品质量以及降低成本而言至关重要。近年来,许多类型的半导体制造设备都配备了传感器,以助力对生产过程进行实时监控。这些生产状态和设备状态的传感器数据为在诸如异常/故障检测、维护调度、质量预测等各个领域应用机器学习技术提供了契机。在这项工作中,我们聚焦于计量系统中的软传感回归问题,该问题利用在晶圆加工步骤中收集的传感器数据来预测以往在晶圆检测和计量系统中所测量的即将进行的检测测量值。我们提出了一种基于长短期记忆网络的回归器,并为训练模型设计了两种不同的损失函数。尽管工程师对我们预测误差的评估是主观的,但引入了一种新颖的分段评估指标以数学方式评估模型准确性。我们的实验结果表明,所提出的模型能够在复杂制造过程中的各类检测中实现准确且早期的预测。