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使用根据表面积和平均颗粒间距离调整的片剂抗张强度来评估主要的结合机制。

Use of tablet tensile strength adjusted for surface area and mean interparticulate distance to evaluate dominating bonding mechanisms.

作者信息

Adolfsson A, Gustafsson C, Nyström C

机构信息

Department of Pharmacy, Uppsala University, Sweden.

出版信息

Drug Dev Ind Pharm. 1999 Jun;25(6):753-64. doi: 10.1081/ddc-100102235.

Abstract

In this study, tablet tensile strength has been adjusted for tablet surface area and the average distance between particles in compacts of different materials. The aim of the study was to evaluate the feasibility of using this concept to assess the dominating interparticulate bonding mechanisms. Adjustment of the tensile strength for both tablet surface area and mean pore radius gave similar bonding strength values for materials bonding mainly by weak distance forces (crystalline lactose, sucrose, and microcrystalline cellulose) almost independently of compaction pressure. However, particle size and other factors may still affect the compensated strength values. The bond strength was much higher and more varied for materials bonding also with solid bridges (potassium chloride, sodium chloride, and possibly also sodium bicarbonate and amorphous lactose). For these materials, particle size and compaction pressure had a substantial effect on the bond strength. It is probably the formation of continuous bridges between adjacent particles that is important in these materials rather than the surface properties and the average distance between particles positioned at some distance from each other. Hence, adjusting the tensile strength of compacts does not necessarily reflect all the dominating factors responsible for interparticulate bonding. Nonetheless, adjustment for tablet surface area and mean pore radius allowed discrimination between different dominating interparticulate bonding mechanisms in these compacted materials.

摘要

在本研究中,已针对片剂表面积以及不同材料压片中颗粒之间的平均距离对片剂抗张强度进行了调整。本研究的目的是评估使用这一概念来评估主要颗粒间结合机制的可行性。针对片剂表面积和平均孔径对抗张强度进行调整后,对于主要通过弱距离力结合的材料(结晶乳糖、蔗糖和微晶纤维素),几乎与压实压力无关,得到了相似的结合强度值。然而,颗粒大小和其他因素可能仍然会影响补偿后的强度值。对于也通过固体桥键结合的材料(氯化钾、氯化钠,可能还有碳酸氢钠和无定形乳糖),键合强度更高且变化更大。对于这些材料,颗粒大小和压实压力对键合强度有很大影响。在这些材料中,相邻颗粒之间形成连续桥键可能比表面性质以及相互之间有一定距离的颗粒之间的平均距离更为重要。因此,调整压片的抗张强度不一定能反映出颗粒间结合的所有主要因素。尽管如此,针对片剂表面积和平均孔径进行调整能够区分这些压实材料中不同的主要颗粒间结合机制。

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