Satoh Tomoaki, Ashitaka Tetsuo, Orihara Shinya, Saimoto Yoshihisa, Konno Mikio
Department of Chemical Engineering, Tohoku University, Sendai, 980-8579, Japan
J Colloid Interface Sci. 2001 Feb 1;234(1):19-23. doi: 10.1006/jcis.2000.7277.
The electrorheological response and structure growth of colloidal silica suspension was studied with in situ measurements of the shear stress, electric conductivity, and dielectric permittivity of the suspension. The measurements were carried out under steady and sweep shears after the application of an electric field of alternative current (100 Hz) using silica particles with a diameter of 630 nm and a water content of 4.5 wt%. The measurements of the conductivity enabled the detection of structure growth formed by particle aggregation and clarified that the development of the particle aggregation enlarged the dielectric permittivity and the shear stress. Hysteretic behavior observed in the electrorheological response was explained by considering structure growth of the particle aggregation. The correlation equation for the shear stress and the dielectric permittivity obtained in our previous work (1) was found to be applicable to the present results. Copyright 2001 Academic Press.
通过对胶体二氧化硅悬浮液的剪切应力、电导率和介电常数进行原位测量,研究了其电流变响应和结构生长。使用直径为630nm、含水量为4.5wt%的二氧化硅颗粒,在施加交流电(100Hz)电场后,在稳定剪切和扫描剪切条件下进行测量。电导率的测量能够检测由颗粒聚集形成的结构生长,并表明颗粒聚集的发展增大了介电常数和剪切应力。通过考虑颗粒聚集的结构生长来解释电流变响应中观察到的滞后行为。发现我们之前工作(1)中获得的剪切应力和介电常数的相关方程适用于当前结果。版权所有2001年学术出版社。