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使用旋转剪切装置研究薄约束薄膜中的摩擦和剪切断裂。

Studying friction and shear fracture in thin confined films using a rotational shear apparatus.

作者信息

Chaudhury Manoj K, Chung Jun Young

机构信息

Department of Chemical Engineering, Lehigh University, Bethlehem, PA 18015, USA.

出版信息

Langmuir. 2007 Jul 17;23(15):8061-6. doi: 10.1021/la700501m. Epub 2007 Jun 16.

Abstract

This paper describes the effects of the elastic modulus and sliding velocity on the friction and shear fracture of smooth silanized rigid disks rotating against thin confined films of poly(dimethylsiloxane) (PDMS) elastomers. A rigid glass disk is rotated against thin PDMS films of different thicknesses and moduli bonded to a glass plate at various speeds. While the disk rotates on the PDMS coated glass plate, a load cell measures the resulting force with a cantilever beam. One end of the cantilever beam is glued to the glass plate, while its other end presses against a load cell. From the balance of forces and torques, the friction force at a given slip velocity is determined. The friction force increases with the slip velocity sublinearly, which is consistent with the results reported previously by Vorvolakos and Chaudhury (Langmuir 2003, 19, 6778). During rotation, however, the glass disk comes off the PDMS film when the shear stress reaches a critical value. This critical shear stress increases with the modulus of the film, but it decreases with its thickness, following a square root relationship, which is similar to the adhesive fracture behavior in thin films under pull-off conditions. A simple model is presented that captures the essential physics of the fracture behavior under shear mode.

摘要

本文描述了弹性模量和滑动速度对光滑硅烷化刚性圆盘与聚二甲基硅氧烷(PDMS)弹性体的薄约束膜相对旋转时的摩擦和剪切断裂的影响。一个刚性玻璃圆盘以不同速度相对于粘结在玻璃板上的不同厚度和模量的薄PDMS膜旋转。当圆盘在涂有PDMS的玻璃板上旋转时,一个测力传感器通过悬臂梁测量产生的力。悬臂梁的一端粘在玻璃板上,而另一端压在测力传感器上。根据力和扭矩的平衡,确定给定滑动速度下的摩擦力。摩擦力随滑动速度呈次线性增加,这与Vorvolakos和Chaudhury之前报道的结果一致(《朗缪尔》,2003年,第19卷,第6778页)。然而,在旋转过程中,当剪切应力达到临界值时,玻璃圆盘会从PDMS膜上脱落。这个临界剪切应力随膜的模量增加而增加,但随膜的厚度减小,遵循平方根关系,这与在剥离条件下薄膜中的粘附断裂行为相似。本文提出了一个简单模型,该模型捕捉了剪切模式下断裂行为的基本物理原理。

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