Månsson Martin, Claesson Thomas, Karlsson Ulf O, Tjernberg Oscar, Pailhés Stéphane, Chang Johan, Mesot Joël, Shi Ming, Patthey Luc, Momono Naoki, Oda Migaku, Ido Masayuki
Materials Physics, Royal Institute of Technology KTH, S-164 40 Kista, Sweden.
Rev Sci Instrum. 2007 Jul;78(7):076103. doi: 10.1063/1.2756754.
An on-board sample cleaver has been developed in order to cleave small and hard-to-cleave samples. To acquire good cleaves from rigid samples the alignment of the cleaving blade with respect to the internal crystallographic planes is crucial. To have the opportunity to mount the sample and align it to the blade ex situ has many advantages. The design presented has allowed us to cleave very tiny and rigid samples, e.g., the high-temperature superconductor La((2-x))Sr(x)CuO(4). Further, in this design the sample and the cleaver will have the same temperature, allowing us to cleave and keep the sample at low temperature. This is a big advantage over prior cleaver systems. As a result, better surfaces and alignments can be realized, which considerably simplifies and improves the experiments.
为了切割小的且难以切割的样品，已开发出一种机载样品切割器。为了从刚性样品获得良好的切割效果，切割刀片相对于内部晶面的对准至关重要。有机会在非原位安装样品并将其与刀片对准具有许多优点。所提出的设计使我们能够切割非常微小和刚性的样品，例如高温超导体La((2 - x))Sr(x)CuO(4)。此外，在这种设计中，样品和切割器将具有相同的温度，这使我们能够在低温下切割并保存样品。这是相对于先前切割器系统的一大优势。结果，可以实现更好的表面和对准，这大大简化并改进了实验。
