Shamsipur Mojtaba, Fasihi Javad, Khanchi Alireza, Hassani Rahim, Alizadeh Kamal, Shamsipur Hosna
Department of Chemistry, Razi University, Kermanshah, Iran.
Anal Chim Acta. 2007 Sep 19;599(2):294-301. doi: 10.1016/j.aca.2007.08.013. Epub 2007 Aug 14.
This work reports the preparation of a new copper(II) ion-imprinted polymer (IIP) material, using 5,6;14,15-dibenzo-1,4-dioxa-8,12-diazacyclopentadecane-5,14-diene (DBDA15C4) and 2-vinylpyridine (VP) as a non-vinylated chelating agent and a functional vinyl monomer, respectively. The Cu2+ ion can form stable complexes with DBDA15C4 and VP. The stoichiometries of Cu2+-DBDA15C4 and ternary Cu2+-DBDA15C4-VP complexes were elucidated using conductometric and spectrophotometric methods, and found to be Cu2+ (DBDA15C4), Cu2+ (DBDA15C4)2 and Cu2+ (DBDA15C4)(VP)2. The results obtained from solution studies were also supported by ab initio theoretical calculations. The resulting ternary complex Cu2+ (DBDA15C4)(VP)2 was copolymerized with ethyleneglycoldimethacrylate, as a cross-linking monomer, via bulk polymerization method. The imprinted copper ion was removed from the polymeric matrix by 0.1 M HNO3. The Cu2+-imprinted polymer particles were characterized by IR spectroscopy and elemental analysis. Optimum pH range for rebinding of Cu2+ on the IIP and equilibrium binding time were 7.0-7.5 and 45 min, respectively. Sorbent capacity and enrichment factor for Cu2+ were obtained as 75.3+/-1.9 micromol g(-1) and 100, respectively. In selectivity study, it was found that imprinting results in increased affinity of the material toward Cu2+ ion over other competitor metal ions with the same charge and close ionic radius. The prepared IIPs were repeatedly used and regenerated for five times without a significant decrease in polymer binding affinities.
本研究报道了一种新型铜(II)离子印迹聚合物(IIP)材料的制备方法,分别使用5,6;14,15-二苯并-1,4-二氧杂-8,12-二氮杂环十五碳-5,14-二烯(DBDA15C4)和2-乙烯基吡啶(VP)作为非乙烯化螯合剂和功能性乙烯基单体。Cu2+离子可与DBDA15C4和VP形成稳定的配合物。采用电导法和分光光度法阐明了Cu2+-DBDA15C4和三元Cu2+-DBDA15C4-VP配合物的化学计量比,发现分别为Cu2+(DBDA15C4)、Cu2+(DBDA15C4)2和Cu2+(DBDA15C4)(VP)2。溶液研究结果也得到了从头算理论计算的支持。所得三元配合物Cu(DBDA15C4)(VP)2与作为交联单体的乙二醇二甲基丙烯酸酯通过本体聚合法进行共聚。用0.1 M HNO3从聚合物基质中除去印迹铜离子。通过红外光谱和元素分析对Cu2+印迹聚合物颗粒进行了表征。Cu2+在IIP上再结合的最佳pH范围和平衡结合时间分别为7.0-7.5和45分钟。Cu2+的吸附容量和富集因子分别为75.3±1.9 μmol g-1和100。在选择性研究中发现,印迹使该材料对Cu离子的亲和力相对于其他具有相同电荷和相近离子半径的竞争金属离子有所增加。所制备的IIP可重复使用和再生5次,聚合物结合亲和力无显著下降。