Huang Zhifeng, Chen Fang, Bennett Peter A, Tao Nongjian
Department of Electrical Engineering and The Center for Solid State Electronics Research, Arizona State University, Tempe, Arizona 85287, USA.
J Am Chem Soc. 2007 Oct 31;129(43):13225-31. doi: 10.1021/ja074456t. Epub 2007 Oct 4.
The stability and breakdown mechanism of a single molecule covalently bound to two Au electrodes via Au-S bonds were studied at room temperature. The distance over which a molecular junction can be stretched before breakdown was measured using a scanning tunneling microscopy break junction approach as a function of stretching rate. At low stretching rates, the stretching distance is small and independent of stretching rate. Above a certain stretching rate, it increases linearly with the logarithm of stretching rate. At very high stretching rates, the stretching distance reaches another plateau and becomes insensitive to the stretching rate again. The three regimes are well described by a thermodynamic bond-breaking model. A comparative study of Au-Au atomic point contacts indicates that the breakdown of the molecular junctions takes place at Au-Au bonds near the molecule-electrode contact. By fitting the experimental data with the model, the lifetime and binding energy were extracted. Both quantities are found to have broad distributions, owing to large variations in the molecule-electrode contact geometry. Although the molecular junctions are short-lived on average, certain contact geometries are considerably more stable. Several types of stochastic fluctuations were observed in the conductance of the molecule junctions, which are attributed to the atomic level rearrangement of the contact geometry, and bond breakdown and reformation processes. The possibility of bond reformation increases the apparent lifetime of the molecular junctions.
在室温下研究了通过金硫键与两个金电极共价结合的单分子的稳定性和断裂机制。使用扫描隧道显微镜断结方法测量分子结在断裂前可拉伸的距离,并将其作为拉伸速率的函数。在低拉伸速率下,拉伸距离较小且与拉伸速率无关。高于一定的拉伸速率时,它随拉伸速率的对数呈线性增加。在非常高的拉伸速率下,拉伸距离达到另一个平台,并且再次对拉伸速率不敏感。这三种情况可以用热力学断键模型很好地描述。对金-金原子点接触的比较研究表明,分子结的断裂发生在分子-电极接触附近的金-金键处。通过用该模型拟合实验数据,提取了寿命和结合能。由于分子-电极接触几何形状的巨大变化,发现这两个量都有广泛的分布。尽管分子结平均寿命较短,但某些接触几何形状相当稳定。在分子结的电导中观察到几种类型的随机波动,这归因于接触几何形状的原子级重排以及键的断裂和重新形成过程。键重新形成的可能性增加了分子结的表观寿命。