Tokuda T, Kawada M, Sugitani S, Taniyama M, Uehara A, Kagawa K, Nunoshita M, Ohta J
Nara Inst. of Sci. & Technol., Nara, Japan.
Conf Proc IEEE Eng Med Biol Soc. 2006;2006:2920-3. doi: 10.1109/IEMBS.2006.260794.
In the present work, we designed a multi-chip-architecture based flexible neural stimulation device for retinal prosthesis. Based on the multi-chip architecture, a novel CMOS stimulation device was successfully designed and characterized. A packaging technique for thin, flexible neural stimulation device was also proposed and demonstrated. Flip-chip bonding technology plays an essential role in the fabrication of the present thin and flexible neural stimulation device.
在本工作中，我们设计了一种基于多芯片架构的用于视网膜假体的柔性神经刺激装置。基于该多芯片架构，成功设计并表征了一种新型的CMOS刺激装置。还提出并展示了一种用于薄型柔性神经刺激装置的封装技术。倒装芯片键合技术在当前薄型柔性神经刺激装置的制造中起着至关重要的作用。
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