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具有受损外孢子囊的蜡样芽孢杆菌孢子的出现:对食品加工生产线表面孢子黏附的影响

Occurrence of Bacillus cereus spores with a damaged exosporium: consequences on the spore adhesion on surfaces of food processing lines.

作者信息

Faille C, Tauveron G, Le Gentil-Lelièvre C, Slomianny C

机构信息

INRA-UR638, 369 rue Jules Guesde, BP 20039, F-59651 Villeneuve d'Ascq Cedex, France.

出版信息

J Food Prot. 2007 Oct;70(10):2346-53. doi: 10.4315/0362-028x-70.10.2346.

Abstract

This study was designed to evaluate the occurrence of Bacillus cereus spores with a damaged exosporium and the consequences of such damages on spore adhesion. The analysis of nine strains sporulated under optimal conditions (Spo8-agar, 30 degrees C) revealed that damaged exosporia were systematically found in one strain (B. cereus D17) and occasionally in two others (B. cereus ATCC 14579T and B. cereus D6). The prevalence of spores with damaged exosporia increased when sporulation occurred under less favorable conditions (Spo8-broth or high temperature); for example, more than 50% of the B. cereus ATCC 14579T spores were damaged when sporulation occurred at 40 degrees C on Spo8-agar or at 30 degrees C in Spo8-broth. Furthermore, when subjected to shear stresses by circulation of spore suspensions through a peristaltic pump, the exosporium of a significant amount of spores became partially or totally shorn off (for example, 40% of the B. cereus ATCC 14579T spores). The ability of damaged spores to adhere to inert surfaces and to resist cleaning under shear stress was significantly affected when compared with intact spores, resulting in a decreased number of adhering spores (P < or = 0.004) and enhanced resistance to cleaning (P < or = 0.008). This study provides evidence that, under various conditions, the exosporium of B. cereus spores can be partly or wholly damaged, thereby affecting the ability of spores to contaminate the surfaces of food processing lines. The presence of spores devoid of exosporium will be of importance in determining the risk associated with B. cereus spores adherent to food processing line surfaces.

摘要

本研究旨在评估具有受损外孢子囊的蜡样芽孢杆菌孢子的发生率,以及此类损伤对孢子粘附的影响。对在最佳条件下(Spo8 - 琼脂,30℃)形成芽孢的9株菌株进行分析发现,在一株菌株(蜡样芽孢杆菌D17)中系统性地发现了受损外孢子囊,另外两株菌株(蜡样芽孢杆菌ATCC 14579T和蜡样芽孢杆菌D6)中偶尔也有发现。当在不太有利的条件下(Spo8 - 肉汤或高温)形成芽孢时,具有受损外孢子囊的孢子的发生率会增加;例如,当在Spo8 - 琼脂上于40℃或在Spo8 - 肉汤中于30℃形成芽孢时,超过50%的蜡样芽孢杆菌ATCC 14579T孢子受到损伤。此外,当通过蠕动泵循环孢子悬浮液使其受到剪切应力时,大量孢子的外孢子囊会部分或全部脱落(例如,40%的蜡样芽孢杆菌ATCC 14579T孢子)。与完整孢子相比,受损孢子粘附到惰性表面以及在剪切应力下抵抗清洗的能力受到显著影响,导致粘附孢子数量减少(P≤0.004),且抗清洗能力增强(P≤0.008)。本研究提供的证据表明,在各种条件下,蜡样芽孢杆菌孢子的外孢子囊可能会部分或全部受损,从而影响孢子污染食品加工生产线表面的能力。缺乏外孢子囊的孢子的存在对于确定与粘附在食品加工生产线表面的蜡样芽孢杆菌孢子相关的风险具有重要意义。

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