Houng B, Kim C Y, Haun M J
Mater. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan 310, R.O.C.
IEEE Trans Ultrason Ferroelectr Freq Control. 2000;47(4):808-18. doi: 10.1109/58.852062.
Piezoelectric glass-ceramics in the lead zirconate titanato-lead silicate system were developed. SiO(2) was required for glass formability, and excess PbO allowed low temperature processing. The amounts of those constituents were limited by the optimization of the piezoelectric properties. Only a small region of compositions in this system yielded the desired combination of glass formability, crystallization and densification behavior, and resulting piezoelectric properties. Selected compositions were melted and roller quenched to form glass ribbon, then milled into glass powder. Pressed glass powder densified to closed porosity at 850 degrees C with piezoelectric d(33 ) and g(33) coefficients of 26 pC/N and 33x10(-3 ) Vm/N. The low temperature sintering behavior of these ferroelectric glass-ceramics provides the possibility of incorporating a piezoelectric material as a sensor or actuator in thick film circuits or low-fire multilayer packages.
在锆钛酸铅 - 硅酸铅体系中开发出了压电微晶玻璃。二氧化硅是玻璃形成所必需的,而过量的氧化铅则允许进行低温加工。这些成分的用量受到压电性能优化的限制。在该体系中,只有一小部分成分组合能产生所需的玻璃形成性、结晶和致密化行为以及由此产生的压电性能。选择的成分被熔化并通过辊淬形成玻璃带,然后研磨成玻璃粉。压制的玻璃粉在850℃下致密化至接近零孔隙率,压电d(33)和g(33)系数分别为26 pC/N和33×10(-3) Vm/N。这些铁电微晶玻璃的低温烧结行为为在厚膜电路或低温多层封装中作为传感器或致动器引入压电材料提供了可能性。