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富勒烯(C60)在高温高压下的拓扑化学3D聚合反应

Topochemical 3D polymerization of C60 under high pressure at elevated temperatures.

作者信息

Yamanaka Shoji, Kini Nagesh S, Kubo Akira, Jida Saeko, Kuramoto Hideaki

机构信息

Department of Applied Chemistry, Graduate School of Engineering, Hiroshima University, Higashi-Hiroshima 739-8527, Japan.

出版信息

J Am Chem Soc. 2008 Apr 2;130(13):4303-9. doi: 10.1021/ja076761k. Epub 2008 Mar 11.

Abstract

Fullerene C60 monomer crystals were compressed to a face-centered cubic (fcc) phase with a lattice parameter of a = 11.93(5) A and a micro-Vickers hardness of 4500 kg/mm2 using high-pressure and high-temperature conditions of 15 GPa at 500-600 degrees C. The hardness is compatible with that of cubic boron nitride (c-BN), suggesting the formation of a 3D C60 polymer. The single-crystal X-ray structural analysis revealed that each C60 molecule in the polymer was linked to the 12 nearest neighbors by [2+2] cycloaddition between the common pentagon-hexagon (56) edges. However, ab initio geometry optimization and molecular dynamics calculations suggested that the 3D polymer should have a rhombohedral structure with the space group of R containing [3+3] cycloaddition between the pentagons of C60 molecules within the plane perpendicular to the 3-fold axis. The higher apparent symmetry of fcc was observed as an averaged structure of different orientations of the rhombohedral structure. The R structure can be derived by only a slight rotation of each C60 unit in the (111) plane of the fcc structure. The band-structure calculation suggested that the 3D polymer (R) was a semiconductor; the activation energy for the electrical conductivity was experimentally determined to be 0.25 eV at 550 K.

摘要

在500 - 600摄氏度、15吉帕的高压高温条件下,富勒烯C60单体晶体被压缩成面心立方(fcc)相,晶格参数a = 11.93(5) Å,显微维氏硬度为4500 kg/mm²。该硬度与立方氮化硼(c - BN)相当,表明形成了三维C60聚合物。单晶X射线结构分析表明,聚合物中的每个C60分子通过公共五边形 - 六边形(56)边之间的[2 + 2]环加成与12个最近邻相连。然而,从头算几何优化和分子动力学计算表明,三维聚合物应具有菱面体结构,空间群为R,在垂直于三重轴的平面内,C60分子的五边形之间存在[3 + 3]环加成。观察到的fcc较高表观对称性是菱面体结构不同取向的平均结构。通过fcc结构(111)平面中每个C60单元的轻微旋转即可得到R结构。能带结构计算表明,三维聚合物(R)是一种半导体;在550 K时,电导率的实验测定活化能为0.25 eV。

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