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超声诊断阵列换能器表面温度升高的预测

Prediction of surface temperature rise of ultrasonic diagnostic array transducers.

作者信息

Ohm Won-Suk, Kim Jeong Hwan, Kim Eun Chul

机构信息

Probe R&D Center, Medison Co., Ltd., Seoul, Republic of Korea.

出版信息

IEEE Trans Ultrason Ferroelectr Freq Control. 2008 Jan;55(1):125-38. doi: 10.1109/TUFFC.2008.622.

Abstract

Temperature rise at the surface of an ultrasound transducer used for diagnostic imaging is an important factor in patient safety and regulatory compliance. This paper presents a semianalytical model that is derived from first principles of heat transfer and is simple enough to be implemented in a commercial ultrasound scanner for real-time forecasting of transducer surface temperature. For modeling purposes, one-dimensional array transducers radiating into still air are considered. Promising experimental verification data are shown and practical implementation benefits of the model for thermal design and management of ultrasonic array transducers are discussed. In particular, the reduction in the amount of thermal characterization data required, compared to empirical models, shows promise.

摘要

用于诊断成像的超声换能器表面温度升高是患者安全和法规遵循方面的一个重要因素。本文提出了一种半解析模型,该模型基于传热的基本原理推导得出,简单到足以在商用超声扫描仪中实现,用于实时预测换能器表面温度。出于建模目的,考虑了向静止空气中辐射的一维阵列换能器。展示了有前景的实验验证数据,并讨论了该模型在超声阵列换能器热设计和管理方面的实际应用优势。特别是,与经验模型相比,所需热特性数据量的减少显示出了前景。

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