Yagai Shiki, Kubota Shun, Iwashima Tomoyuki, Kishikawa Keiki, Nakanishi Takashi, Karatsu Takashi, Kitamura Akihide
Department of Applied Chemistry and Biotechnology, Faculty of Engineering, Chiba University, Chiba, Japan.
Chemistry. 2008;14(17):5246-57. doi: 10.1002/chem.200701782.
Bis- and monoureas hybridized with the oligo(p-phenylene vinylene) (OPV) pi-electronic segment and 3,4,5-tridodecyloxyphenyl wedge were synthesized and their supramolecular polymerization in diluted solution, gel formation in concentrated solution, and liquid crystallinity in bulk state were investigated. Bisurea 1a featuring a hexamethylene linker showed the highest supramolecular polymerization ability and formed tapelike nanofibers that can gelate various organic solvents. On the other hand, bisurea 1b featuring a dodecamethylene linker and monourea 2 showed a lower degree of supramolecular polymerization, resulting in gel formations in a smaller variety of solvents. These results clearly reflect a high level of cooperativity between the two urea sites and the two OPV segments of 1a upon hydrogen-bonding and pi-pi stacking interactions, respectively. When the gels of 1a, 1b, and 2 were dried, all the compounds self-organized into multilamellar superstructures. Thermal treatment of these lamellae at high temperatures induces columnar liquid-crystalline mesophases as a result of microsegregation between the rigid OPV parts and the molten aliphatic wedges. These results demonstrate that the present molecular constituent is very useful for fabricating dye-based functional assemblies providing nanoscale pi-electronic fibers, and solvent-incorporated and bulk soft materials.
合成了与寡聚(对亚苯基亚乙烯基)(OPV)π-电子片段和3,4,5-三(十二烷氧基)苯基楔形物杂交的双脲和单脲,并研究了它们在稀溶液中的超分子聚合、在浓溶液中的凝胶形成以及在本体状态下的液晶性。具有六亚甲基连接基的双脲1a表现出最高的超分子聚合能力,并形成了可以使各种有机溶剂凝胶化的带状纳米纤维。另一方面,具有十二亚甲基连接基的双脲1b和单脲2表现出较低程度的超分子聚合,导致在较少种类的溶剂中形成凝胶。这些结果清楚地反映了1a的两个脲位点与两个OPV片段在分别通过氢键和π-π堆积相互作用时的高度协同性。当1a、1b和2的凝胶干燥时,所有化合物都自组装成多层超结构。在高温下对这些薄片进行热处理会由于刚性OPV部分和熔融脂肪族楔形物之间的微相分离而诱导形成柱状液晶中间相。这些结果表明,目前的分子组成对于制造基于染料的功能组件非常有用,这些组件可提供纳米级π-电子纤维以及包含溶剂的本体软材料。