Mah Jae-Hyung, Kang Dong-Hyun, Tang Juming
Department of Biological Systems Engineering, Washington State University, Pullman, Washington 99164, USA.
J Food Prot. 2008 May;71(5):953-8. doi: 10.4315/0362-028x-71.5.953.
To investigate the primary structural determinants affecting heat resistance of Clostridium sporogenes spores, electron micrographs of heat-sensitive (D121 degrees C = 0.56 min) and heat-resistant (D121 degrees C = 0.93 min) spores of C. sporogenes were taken with a transmission electron microscope. The mean thickness (+/- standard deviation [SD]) of coat layers and cortex regions of heat-sensitive spores were 82.9 +/- 14.5 and 86.0 +/- 22.7 nm, while those of heat-resistant spores were 106.9 +/- 45.7 and 111.7 +/- 32.1 nm, respectively. The thickness of coat (P = 0.031) and cortex (P = 0.006) showed statistically significant differences, suggesting that heat-resistant spores have a thicker coat and cortex than do heat-sensitive spores. The mean sizes (+/- SD) of cores were 467.0 +/- 88.7 nm for heat-sensitive spores and 460.2 +/- 98.5 nm for heat-resistant spores, respectively, which showed no statistically significant differences. The ratios (+/- SD) of the core size to the sporoplast size were 0.84 +/- 0.05 for heat-sensitive spores and 0.80 +/- 0.07 for heat-resistant spores, respectively, showing statistically significant differences (P = 0.030), which indicated that the ratio is negatively related to heat resistance. Accordingly, the structural components of heat-sensitive spores were severely damaged by heat treatment, whereas those of heat-resistant spores were unlysed under the same conditions. Based on the structural analyses of spores, it was elucidated that the thickness of coat layer and cortex region are significantly correlated with heat resistance of C. sporogenes spores, and that cortex region plays a major role in protecting the spore from heat damage.
为研究影响生孢梭菌芽孢耐热性的主要结构决定因素,用透射电子显微镜拍摄了生孢梭菌热敏性芽孢(121℃下D值 = 0.56分钟)和耐热性芽孢(121℃下D值 = 0.93分钟)的电子显微照片。热敏性芽孢的外层和皮层区域的平均厚度(±标准差[SD])分别为82.9±14.5纳米和86.0±22.7纳米,而耐热性芽孢的分别为106.9±45.7纳米和111.7±32.1纳米。外层(P = 0.031)和皮层(P = 0.006)的厚度显示出统计学上的显著差异,表明耐热性芽孢比热敏性芽孢具有更厚的外层和皮层。热敏性芽孢和耐热性芽孢核心的平均大小(±SD)分别为467.0±88.7纳米和460.2±98.5纳米,未显示出统计学上的显著差异。热敏性芽孢和耐热性芽孢核心大小与原生质体大小的比率(±SD)分别为0.84±0.05和0.80±0.07,显示出统计学上的显著差异(P = 0.030),这表明该比率与耐热性呈负相关。因此,热敏性芽孢的结构成分在热处理时受到严重破坏,而耐热性芽孢的结构成分在相同条件下未被裂解。基于芽孢的结构分析,阐明了外层和皮层区域的厚度与生孢梭菌芽孢的耐热性显著相关,并且皮层区域在保护芽孢免受热损伤方面起主要作用。