Petit Mohamed, Hemine Jamal, Daoudi Abdelylah, Ismaili Mimoun, Buisine Jean Marc, Da Costa Antonio
Laboratoire de Thermophysique de la Matière Condensée-Equipe de l' UMR-CNRS 8024, Université du Littoral Côte d'Opale, 145, Avenue Maurice Schumann, 59140 Dunkerque, France.
Phys Rev E Stat Nonlin Soft Matter Phys. 2009 Mar;79(3 Pt 1):031705. doi: 10.1103/PhysRevE.79.031705. Epub 2009 Mar 30.
We report the influence of the polymer network density formed in short-pitch ferroelectric liquid crystal (FLC) on the soft and the Goldstone dielectric relaxation modes. The experimental results of the pure FLC and the FLC stabilized by a polymer network with various densities are presented and compared. These results reveal that in the SmC;{ *} phase, when the polymer concentration increases, the Goldstone dielectric strength gradually decreases and the relaxation frequency is shifted to higher values. In the SmA;{ *} phase, the results show that close to the SmC;{ *}-SmA;{ *} transition temperature, T_{c} , the soft relaxation mode is largely influenced by the polymer network: a sharp decrease in the dielectric strength and an increase in the relaxation frequency when the polymer density increases were observed. The soft mode is relatively weakly affected by the network for higher temperatures (T> or =T_{c}+0.5 degrees C) . This indicates that the behavior of the soft mode for this temperature domain is dominated rather by thermal effects than by the network. A simple phenomenological approach was proposed to explain the behavior of the soft-mode dielectric strength versus polymer concentration. This model takes into account the anisotropic interaction between the polymer network and the liquid crystal, and the elastic interaction resulting from the anchoring of the liquid crystal molecules at the polymer surfaces. The experimental results are in agreement with the proposed model.
我们报道了在短间距铁电液晶(FLC)中形成的聚合物网络密度对软模和戈德斯通介电弛豫模式的影响。给出并比较了纯FLC以及由不同密度聚合物网络稳定的FLC的实验结果。这些结果表明,在SmC相,当聚合物浓度增加时,戈德斯通介电强度逐渐降低,弛豫频率向更高值移动。在SmA相,结果表明,接近SmC*-SmA*转变温度Tc时,软弛豫模式受聚合物网络的影响很大:观察到当聚合物密度增加时,介电强度急剧下降,弛豫频率增加。对于较高温度(T≥Tc+0.5℃),软模受网络的影响相对较弱。这表明该温度域内软模的行为主要由热效应而非网络主导。提出了一种简单的唯象方法来解释软模介电强度与聚合物浓度的关系。该模型考虑了聚合物网络与液晶之间的各向异性相互作用,以及液晶分子在聚合物表面锚定产生的弹性相互作用。实验结果与所提出的模型一致。