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通过电化学催化点击化学获得的聚合物多层膜。

Polymer multilayer films obtained by electrochemically catalyzed click chemistry.

机构信息

Centre National de la Recherche Scientifique, Unité Propre de Recherche 22, Institut Charles Sadron, 23 rue du Loess, BP 84047, 67034 Strasbourg Cedex 2, France.

出版信息

Langmuir. 2010 Feb 16;26(4):2816-24. doi: 10.1021/la902874k.

Abstract

We report the covalent layer-by-layer construction of polyelectrolyte multilayer (PEM) films by using an efficient electrochemically triggered Sharpless click reaction. The click reaction is catalyzed by Cu(I) which is generated in situ from Cu(II) (originating from the dissolution of CuSO(4)) at the electrode constituting the substrate of the film. The film buildup can be controlled by the application of a mild potential inducing the reduction of Cu(II) to Cu(I) in the absence of any reducing agent or any ligand. The experiments were carried out in an electrochemical quartz crystal microbalance cell which allows both to apply a controlled potential on a gold electrode and to follow the mass deposited on the electrode through the quartz crystal microbalance. Poly(acrylic acid) (PAA) modified with either alkyne (PAA(Alk)) or azide (PAA(Az)) functions grafted onto the PAA backbone through ethylene glycol arms were used to build the PEM films. Construction takes place on gold electrodes whose potentials are more negative than a critical value, which lies between -70 and -150 mV vs Ag/AgCl (KCl sat.) reference electrode. The film thickness increment per bilayer appears independent of the applied voltage as long as it is more negative than the critical potential, but it depends upon Cu(II) and polyelectrolyte concentrations in solution and upon the reduction time of Cu(II) during each deposition step. An increase of any of these latter parameters leads to an increase of the mass deposited per layer. For given buildup conditions, the construction levels off after a given number of deposition steps which increases with the Cu(II) concentration and/or the Cu(II) reduction time. A model based on the diffusion of Cu(II) and Cu(I) ions through the film and the dynamics of the polyelectrolyte anchoring on the film, during the reduction period of Cu(II), is proposed to explain the major buildup features.

摘要

我们报告了通过使用有效的电化学触发 Sharpless 点击反应,将聚电解质多层(PEM)膜进行共价逐层构建。点击反应由 Cu(I)催化,Cu(I)是由构成膜基底的电极处原位生成的 Cu(II)(源自 CuSO4 的溶解)。可以通过施加温和的电势来控制膜的构建,该电势在没有任何还原剂或任何配体的情况下诱导 Cu(II)还原为 Cu(I)。实验是在电化学石英晶体微天平电池中进行的,该电池允许在金电极上施加受控电势,并通过石英晶体微天平跟踪电极上沉积的质量。通过乙二醇臂接枝到 PAA 主链上的炔基(PAA(Alk))或叠氮化物(PAA(Az))功能化的聚(丙烯酸)(PAA)被用于构建 PEM 膜。构建过程发生在金电极上,其电势比临界值更负,该临界值介于-70 和-150 mV 相对于 Ag/AgCl(饱和 KCl)参比电极。只要电势比临界电势更负,每双层的膜厚度增量似乎与所施加的电压无关,但它取决于溶液中的 Cu(II)和聚电解质浓度以及每个沉积步骤中 Cu(II)的还原时间。这些后参数中的任何一个的增加都会导致沉积层的质量增加。在给定的构建条件下,在给定数量的沉积步骤之后,构建水平趋于平稳,该数量随着 Cu(II)浓度和/或 Cu(II)还原时间的增加而增加。提出了一种基于 Cu(II)和 Cu(I)离子在膜中的扩散以及 Cu(II)还原期间聚电解质在膜上的锚固动力学的模型,以解释主要的构建特征。

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