用于硅片的混合表面温度传感器的不确定性及其与嵌入式热电偶的比较。

Uncertainty of a hybrid surface temperature sensor for silicon wafers and comparison with an embedded thermocouple.

作者信息

Iuchi Tohru, Gogami Atsushi

机构信息

Department of Mechanical Engineering, Toyo University, 2100 Kujirai, Kawagoe, Saitama 350-8585, Japan.

出版信息

Rev Sci Instrum. 2009 Dec;80(12):126109. doi: 10.1063/1.3274676.

DOI:10.1063/1.3274676

PMID:20059183

Abstract

We have developed a user-friendly hybrid surface temperature sensor. The uncertainties of temperature readings associated with this sensor and a thermocouple embedded in a silicon wafer are compared. The expanded uncertainties (k=2) of the hybrid temperature sensor and the embedded thermocouple are 2.11 and 2.37 K, respectively, in the temperature range between 600 and 1000 K. In the present paper, the uncertainty evaluation and the sources of uncertainty are described.

摘要

我们开发了一种用户友好型混合表面温度传感器。将该传感器与嵌入硅片中的热电偶相关的温度读数不确定性进行了比较。在600至1000 K的温度范围内，混合温度传感器和嵌入式热电偶的扩展不确定度（k = 2）分别为2.11 K和2.37 K。本文描述了不确定度评估和不确定度来源。