Kinoshita K, Kobayashi M
Appl Opt. 1979 Oct 1;18(19):3256-60. doi: 10.1364/AO.18.003256.
Mirror-finished end preparation and low-loss splicing of silica fiber arrays by means of a CO(2) laser are demonstrated. Eight-fiber linear arrays of multimode fibers with 60-microm core diam and 150-microm outer diam were laser scribed and fractured, then butted and spliced with 3.0-W laser power output, 1.0-mm beam-spot diam, and 15-microm/sec fiber array driving speed. Average splice losses for 20x splicings (160 splices) in step- and graded-index fibers were 0.12 db and 0.10 dB, respectively. The air bubbles sometimes observed at the splicing point in fusion splices were avoided by preparing fiber ends with a laser-scribing method.
展示了通过二氧化碳激光对石英光纤阵列进行镜面抛光端面制备和低损耗熔接。对芯径60微米、外径150微米的多模光纤的八光纤线性阵列进行激光划刻和断裂处理,然后以3.0瓦的激光输出功率、1.0毫米的光斑直径和15微米/秒的光纤阵列驱动速度进行对接和熔接。阶跃折射率光纤和渐变折射率光纤中20次熔接(160个接头)的平均熔接损耗分别为0.12分贝和0.10分贝。通过激光划刻法制备光纤端面,避免了熔接时在熔接处有时会观察到的气泡。