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一种用于纳米流体热导率的分子动力学 - 随机模型及其实验验证。

A molecular dynamics-stochastic model for thermal conductivity of nanofluids and its experimental validation.

作者信息

Ghosh Madan Mohan, Roy Someshwar, Pabi Shyamal Kumar, Ghosh Sudipto

机构信息

Department of Metallurgical and Materials Engineering, Indian Institute of Technology, Kharagpur 721302, India.

出版信息

J Nanosci Nanotechnol. 2011 Mar;11(3):2196-207. doi: 10.1166/jnn.2011.3557.

Abstract

A model to predict the enhanced thermal conductivity of water based copper nanofluid on the basis of molecular dynamics simulation coupled with stochastic simulation shows for the first time that the temperature of a copper nanoparticle colliding with a heat source can rise rapidly within the short collision period (e.g., 10-50 ps) estimated by impact dynamics due to phonon transfer. Thereafter the particles undergo Brownian movement in the base fluid and transfer the excess heat in about 2 to 3 ms to the surrounding fluid resulting in an appreciable enhancement of the thermal conductivity of the fluid. Microconvection has minor contribution to the enhanced thermal conductivity of nanofluids. The predicted thermal conductivity of nanofluid and its variation with the volume fraction of the nanoparticles agree well with the present experiments, as well as, with the data reported in the literature.

摘要

基于分子动力学模拟与随机模拟相结合的预测水基铜纳米流体热导率增强的模型首次表明,由于声子传递,在冲击动力学估计的短碰撞期(例如10 - 50皮秒)内,与热源碰撞的铜纳米颗粒的温度会迅速升高。此后,颗粒在基液中进行布朗运动,并在约2至3毫秒内将多余的热量传递给周围流体,导致流体的热导率显著提高。微对流对纳米流体热导率的增强贡献较小。预测的纳米流体热导率及其随纳米颗粒体积分数的变化与当前实验以及文献报道的数据吻合良好。

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