Hwang Seulgi, Kim Youngman
Department of Materials Science and Engineering, Chonnam National University, Gwangju 500-757, Korea.
J Nanosci Nanotechnol. 2011 Aug;11(8):7285-9. doi: 10.1166/jnn.2011.4776.
Thin films are used in wide range of applications in industry, such as solar cells and LEDs. When thin films are deposited on substrates, various stresses are generated due to the mechanical difference between the film and substrate. These stresses can cause defects, such as cracking and buckling. Therefore, knowledge of the mechanical properties is important for improving their reliability and stability. In this study, the thermal expansion coefficient of FCC metallic thin films, such as Ag and Cu, which have different grain sizes and thicknesses, were calculated using the thermal cycling method. As a result, thermal expansion coefficient increased with increasing grain size. However, the film thickness had no remarkable effect.
薄膜在工业中有广泛的应用，如太阳能电池和发光二极管。当薄膜沉积在基板上时，由于薄膜和基板之间的机械差异会产生各种应力。这些应力会导致缺陷，如开裂和屈曲。因此，了解机械性能对于提高其可靠性和稳定性很重要。在本研究中，使用热循环法计算了具有不同晶粒尺寸和厚度的面心立方金属薄膜（如银和铜）的热膨胀系数。结果表明，热膨胀系数随晶粒尺寸的增加而增大。然而，薄膜厚度没有显著影响。
