Department of Chemistry, Purdue University, West Lafayette, Indiana 47907-2067, USA.
ACS Appl Mater Interfaces. 2012 May;4(5):2515-20. doi: 10.1021/am300217n. Epub 2012 Apr 18.
Aerosol deposition of singly charged monodisperse copper nanoparticles was used to catalytically activate a polymer substrate for electroless silver deposition. An ambient spark discharge was used to produce aerosol copper nanoparticles, and the particles were electrostatically classified at an equivalent mobility diameter of 10 nm, using a nanodifferential mobility analyzer. Deposition of the copper particles onto the surface of the substrate was enhanced by thermophoresis. The copper-deposited substrate was then immersed in a Ag(I) solution, resulting in the electroless deposition of silver (∼17 μm line width) on the previously deposited copper (∼12 μm line width, using a shadow mask with a 100 μm in width patterned stripe). The arithmetic mean roughness and electrical resistivity of the silver pattern were 44.7 nm and 7.9 μΩ cm, respectively, which showed an enhancement compared to those from the nonclassified copper particles (roughness = 162.2 nm, resistivity = 13.3 μΩ cm), because of a more-uniform copper deposition.
采用单电荷单分散铜纳米颗粒的气溶胶沉积法来催化激活聚合物基底，以进行无电电镀银沉积。使用环境火花放电来产生气溶胶铜纳米颗粒，并使用纳米差分迁移率分析仪在等效迁移率直径为 10nm 处对颗粒进行静电分级。通过热泳将铜颗粒沉积到基底表面上，从而增强了沉积效果。然后将沉积有铜的基底浸入 Ag(I)溶液中，导致之前沉积的铜上发生无电镀银（线宽约为 17μm，使用宽度为 100μm 的带有 100μm 宽度图案化条纹的阴影掩模）。银图案的算术平均粗糙度和电阻率分别为 44.7nm 和 7.9μΩcm，与未分级的铜颗粒相比（粗糙度=162.2nm，电阻率=13.3μΩcm）有所提高，这是因为铜的沉积更加均匀。
