通过添加铜大幅提高Sm-(Co,Cu)/Fe薄膜的矫顽力。

Large improvement of coercivity in Sm-(Co,Cu)/Fe films by Cu addition.

作者信息

Zhang Jian, Wang Fang, Zhang Yong, Song Ji-Zhong, Zhang Yun, Shen Bao-Gen, Sun Ji-Rong

机构信息

Key Laboratory of Magnetic Materials and Devices, Chinese Academe of Science (CAS), Ningbo Institute of Material Technology and Engineering (CAS), Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo 315201, People's Republic of China.

出版信息

J Nanosci Nanotechnol. 2012 Feb;12(2):1109-13. doi: 10.1166/jnn.2012.4269.

DOI:10.1166/jnn.2012.4269

PMID:22629904

Abstract

The magnetic properties and microstructure of Sm-(Co,Cu)/Fe films were investigated systematically. The addition of Cu is helpful for keeping a better multilayer structure due to the reduction of the crystallization temperature of the hard phase. With lowering the temperature, the coercivity of the Sm-(Co,Cu)/Fe films increases rapidly with a linear relationship. The Cu addition significantly improves the coercivities of the Sm-(Co,Cu)/Fe multilayer films, especially at the low temperatures. Adding the Cu as well as lowering the temperature cause a large inhomogeneity in the hard phase, and therefore a high pinning coercivity.

摘要

系统研究了Sm-(Co,Cu)/Fe薄膜的磁性和微观结构。由于硬相结晶温度的降低，Cu的添加有助于保持更好的多层结构。随着温度降低，Sm-(Co,Cu)/Fe薄膜的矫顽力呈线性关系迅速增加。Cu的添加显著提高了Sm-(Co,Cu)/Fe多层薄膜的矫顽力，尤其是在低温下。添加Cu以及降低温度会导致硬相出现较大的不均匀性，从而产生较高的钉扎矫顽力。