Li Y G, Zhang P, Ding Z J
Hefei National Laboratory for Physical Sciences at Microscale and Department of Physics, University of Science and Technology of China, Hefei, Anhui, China.
Scanning. 2013 Mar-Apr;35(2):127-39. doi: 10.1002/sca.21042. Epub 2012 Aug 9.
In semiconductor industry, strict critical dimension control by using a critical dimension scanning electron microscope (CD-SEM) is an extremely urgent task in near-term years. A Monte Carlo simulation model for study of CD-SEM image has been established, which is based on using Mott's cross section for electron elastic scattering and the full Penn dielectric function formalism for electron inelastic scattering and the associated secondary electron (SE) production. In this work, a systematic calculation of CD-SEM line-scan profiles and 2D images of trapezoidal Si lines has been performed by taking into account different experimental factors including electron beam condition (primary energy, probe size), line geometry (width, height, foot/corner rounding, sidewall angle, and roughness), material properties, and SE signal detection. The influences of these factors to the critical dimension metrology are investigated, leading to build a future comprehensive model-based library.
在半导体行业,利用临界尺寸扫描电子显微镜(CD - SEM)进行严格的临界尺寸控制是近年来一项极其紧迫的任务。已建立了一个用于研究CD - SEM图像的蒙特卡罗模拟模型,该模型基于使用莫特截面进行电子弹性散射、全彭氏介电函数形式进行电子非弹性散射以及相关二次电子(SE)产生。在这项工作中,通过考虑不同的实验因素,包括电子束条件(一次能量、探针尺寸)、线条几何形状(宽度、高度、底部/拐角圆角、侧壁角度和粗糙度)、材料特性以及SE信号检测,对梯形硅线的CD - SEM线扫描轮廓和二维图像进行了系统计算。研究了这些因素对临界尺寸计量的影响,从而构建一个未来基于综合模型的库。