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无催化剂掺杂的 InAs 纳米线的原位掺杂。

In situ doping of catalyst-free InAs nanowires.

机构信息

IBM Research-Zürich, Säumerstrasse 4, 8803 Rüschlikon, Switzerland.

出版信息

Nanotechnology. 2012 Dec 21;23(50):505708. doi: 10.1088/0957-4484/23/50/505708. Epub 2012 Nov 27.

Abstract

We report on in situ doping of InAs nanowires grown by metal-organic vapor-phase epitaxy without any catalyst particles. The effects of various dopant precursors (Si(2)H(6), H(2)S, DETe, CBr(4)) on the nanowire morphology and the axial and radial growth rates are investigated to select dopants that enable control of the conductivity in a broad range and that concomitantly lead to favorable nanowire growth. In addition, the resistivity of individual wires was measured for different gas-phase concentrations of the dopants selected, and the doping density and mobility were extracted. We find that by using Si(2)H(6) axially and radially uniform doping densities up to 7 × 10(19) cm(-3) can be obtained without affecting the morphology or growth rates. For sulfur-doped InAs nanowires, we find that the distribution coefficient depends on the growth conditions, making S doping more difficult to control than Si doping. Moreover, above a critical sulfur gas-phase concentration, compensation takes place, limiting the maximum doping level to 2 × 10(19) cm(-3). Finally, we extract the specific contact resistivity as a function of doping concentration for Ti and Ni contacts.

摘要

我们报告了在没有任何催化剂颗粒的情况下,通过金属有机气相外延生长的原位掺杂 InAs 纳米线。研究了各种掺杂剂前体(Si(2)H(6)、H(2)S、DETe、CBr(4))对纳米线形貌以及轴向和径向生长速率的影响,以选择能够在较宽范围内控制电导率且同时有利于纳米线生长的掺杂剂。此外,还测量了所选掺杂剂的不同气相浓度下的单个线的电阻率,并提取了掺杂密度和迁移率。我们发现,通过使用 Si(2)H(6),可以在不影响形貌或生长速率的情况下获得高达 7×10(19)cm(-3)的轴向和径向均匀掺杂密度。对于硫掺杂的 InAs 纳米线,我们发现分布系数取决于生长条件,使得 S 掺杂比 Si 掺杂更难控制。此外,在临界硫气相浓度以上,会发生补偿,限制最大掺杂水平至 2×10(19)cm(-3)。最后,我们提取了 Ti 和 Ni 接触的特定接触电阻率作为掺杂浓度的函数。

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