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用于在毛细硅纳米线平台上实现小型化的生物分子光附着

Photo-attachment of biomolecules for miniaturization on wicking Si-nanowire platform.

作者信息

Cheng He, Zheng Han, Wu Jia Xin, Xu Wei, Zhou Lihan, Leong Kam Chew, Fitzgerald Eugene, Rajagopalan Raj, Too Heng Phon, Choi Wee Kiong

机构信息

Advanced Materials for Micro- and Nano- Systems, Singapore-MIT Alliance, Singapore, Singapore.

Department of Electrical and Computer Engineering, National University of Singapore, Singapore, Singapore.

出版信息

PLoS One. 2015 Feb 17;10(2):e0116539. doi: 10.1371/journal.pone.0116539. eCollection 2015.

Abstract

We demonstrated the surface functionalization of a highly three-dimensional, superhydrophilic wicking substrate using light to immobilize functional biomolecules for sensor or microarray applications. We showed here that the three-dimensional substrate was compatible with photo-attachment and the performance of functionalization was greatly improved due to both increased surface capacity and reduced substrate reflectivity. In addition, photo-attachment circumvents the problems induced by wicking effect that was typically encountered on superhydrophilic three-dimensional substrates, thus reducing the difficulty of producing miniaturized sites on such substrate. We have investigated various aspects of photo-attachment process on the nanowire substrate, including the role of different buffers, the effect of wavelength as well as how changing probe structure may affect the functionalization process. We demonstrated that substrate fabrication and functionalization can be achieved with processes compatible with microelectronics processes, hence reducing the cost of array fabrication. Such functionalization method coupled with the high capacity surface makes the substrate an ideal candidate for sensor or microarray for sensitive detection of target analytes.

摘要

我们展示了一种高度三维的超亲水芯吸底物的表面功能化,利用光固定功能生物分子用于传感器或微阵列应用。我们在此表明,三维底物与光附着兼容,并且由于表面容量增加和底物反射率降低,功能化性能得到了极大改善。此外,光附着避免了超亲水三维底物上通常遇到的芯吸效应引起的问题,从而降低了在这种底物上产生微型化位点的难度。我们研究了纳米线底物上光附着过程的各个方面,包括不同缓冲液的作用、波长的影响以及改变探针结构如何影响功能化过程。我们证明了底物制造和功能化可以通过与微电子工艺兼容的过程来实现,从而降低了阵列制造的成本。这种功能化方法与高容量表面相结合,使该底物成为用于灵敏检测目标分析物的传感器或微阵列的理想候选者。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/2d69/4331555/9c5844291610/pone.0116539.g001.jpg

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