Cheng Risheng, Guo Xiang, Ma Xiaosong, Fan Linran, Fong King Y, Poot Menno, Tang Hong X
Opt Express. 2016 Nov 28;24(24):27070-27076. doi: 10.1364/OE.24.027070.
We describe a micromachining process to allow back-side coupling of an array of single-mode telecommunication fibers to individual superconducting nanowire single photon detectors (SNSPDs). This approach enables a back-illuminated detector structure which separates the optical access and electrical readout on two sides of the chip and thus allows for compact integration of multi-channel detectors. As proof of principle, we show the integration of four detectors on the same silicon chip with two different designs and their performances are compared. In the optimized design, the device shows saturated system detection efficiency of 16% while the dark count rate is less than 20 Hz, all achieved without the use of metal reflectors or distributed Bragg reflectors (DBRs). This back-illumination approach also eliminates the cross-talk between different detection channels.
我们描述了一种微加工工艺,用于实现单模通信光纤阵列与单个超导纳米线单光子探测器(SNSPD)的背面耦合。这种方法能够实现背照式探测器结构,该结构将芯片两侧的光学接入和电读出分开,从而实现多通道探测器的紧凑集成。作为原理验证,我们展示了在同一硅芯片上集成四个具有两种不同设计的探测器,并比较了它们的性能。在优化设计中,该器件的饱和系统探测效率为16%,暗计数率小于20 Hz,所有这些都是在不使用金属反射器或分布式布拉格反射器(DBR)的情况下实现的。这种背照式方法还消除了不同探测通道之间的串扰。