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制造工艺对MetalMUMPs致动器中多层结构可靠性的影响:残余应力与设计参数变化

Effects of the Manufacturing Process on the Reliability of the Multilayer Structure in MetalMUMPs Actuators: Residual Stresses and Variation of Design Parameters.

作者信息

Guo Jianbin, Wang Jinling, Zeng Shengkui, Silberschmidt Vadim V, Shen Yongguang

机构信息

School of Reliability and Systems Engineering, Beihang University, Beijing 100191, China.

School of Electrical and Electionic Engieering, Zibo Vacational Insititute, Zibo 255314, China.

出版信息

Micromachines (Basel). 2017 Nov 29;8(12):348. doi: 10.3390/mi8120348.

Abstract

Potential problems induced by the multilayered manufacturing process pose a serious threat to the long-term reliability of MEMSCAP actuators under in-service thermal cycling. Damage would initiate and propagate in different material layers because of a large mismatch of their thermal expansions. In this research, residual stresses and variations of design parameters induced by metal multi-user micro electromechanical system processes (MetalMUMPs) were examined to evaluate their effects on the thermal fatigue lifetime of the multilayer structure and, thus, to improve MEMSCAP design. Since testing in such micro internal structure is difficult to conduct and traditional testing schemes are destructive, a numerical subdomain method based on a finite element technique was employed. Thermomechanical deformation from metal to insulator layers under in-service temperature cycling (obtained from the multiphysics model of the entire actuator, which was validated by experimental and specified analytical solutions) was accurately estimated to define failures with a significant efficiency and feasibility. Simulation results showed that critical failure modes included interface delamination, plastic deformation, micro cracking, and thermal fatigue, similarly to what was concluded in the MEMSCAP technical report.

摘要

多层制造工艺引发的潜在问题对MEMS电容式微机电系统(MEMSCAP)致动器在实际热循环条件下的长期可靠性构成严重威胁。由于不同材料层的热膨胀系数存在较大差异,损伤会在这些材料层中萌生并扩展。在本研究中,对金属多用户微机电系统工艺(MetalMUMPs)引起的残余应力和设计参数变化进行了研究,以评估它们对多层结构热疲劳寿命的影响,从而改进MEMSCAP的设计。由于在这种微观内部结构中进行测试困难,且传统测试方案具有破坏性,因此采用了基于有限元技术的数值子域方法。通过精确估计在实际温度循环下(从整个致动器的多物理场模型中获得,该模型已通过实验和特定解析解验证)从金属层到绝缘层的热机械变形,能够高效且可行地确定失效情况。模拟结果表明,关键失效模式包括界面分层、塑性变形、微裂纹和热疲劳,这与MEMSCAP技术报告中的结论类似。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/70c1/6187910/0f6b951fe2f0/micromachines-08-00348-g001.jpg

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