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UV/氯协同作用下 Cu(II)-EDTA 的自动解络合及其对水溶液中 Cu(II)的去除

Autocatalytic Decomplexation of Cu(II)-EDTA and Simultaneous Removal of Aqueous Cu(II) by UV/Chlorine.

机构信息

School of Life and Environmental Science , Wenzhou University , Wenzhou , 325035 , China.

School of Environmental Science and Engineering , Zhejiang Gongshang University , Hangzhou , 310018 , China.

出版信息

Environ Sci Technol. 2019 Feb 19;53(4):2036-2044. doi: 10.1021/acs.est.8b05346. Epub 2019 Feb 1.

DOI:10.1021/acs.est.8b05346
PMID:30653306
Abstract

Traditional processes usually cannot enable efficient water decontamination from toxic heavy metals complexed with organic ligands. Herein, we first reported the removal of Cu(II)-EDTA by a UV/chlorine process, where the Cu(II)-EDTA degradation obeyed autocatalytic two-stage kinetics, and Cu(II) was simultaneously removed as CuO precipitate. The scavenging experiments and EPR analysis indicated that Cl accounted for the Cu(II)-EDTA degradation at diffusion-controlled rate (∼10 M s). Mechanism study with mass spectrometry evidence of 11 key intermediates revealed that the Cu(II)-EDTA degradation by UV/chlorine was an autocatalytic successive decarboxylation process mediated by the Cu(II)/Cu(I) redox cycle. Under UV irradiation, Cu(I) was generated during the photolysis of the Cl-attacked complexed Cu(II) via ligand-to-metal charge transfer (LMCT). Both free and organic ligand-complexed Cu(I) could form binary/ternary complexes with ClO, which were oxidized back to Cu(II) via metal-to-ligand charge transfer (MLCT) with simultaneous production of Cl, resulting in the autocatalytic effect on Cu(II)-EDTA removal. Effects of chlorine dosage and pH were examined, and the technological practicability was validated with authentic electroplating wastewater and other Cu(II)-organic complexes. This study shed light on a new mechanism of decomplexation by Cl and broadened the applicability of the promising UV/chlorine process in water treatment.

摘要

传统工艺通常无法有效去除与有机配体络合的有毒重金属。本文首次报道了 UV/氯工艺去除 Cu(II)-EDTA 的过程,其中 Cu(II)-EDTA 的降解遵循自催化两阶段动力学,同时 Cu(II)作为 CuO 沉淀被去除。猝灭实验和 EPR 分析表明,Cl 以扩散控制速率(~10 M s)决定 Cu(II)-EDTA 的降解。通过质谱证据确定的 11 个关键中间产物的机理研究表明,UV/氯通过 Cu(II)/Cu(I)氧化还原循环介导的自动催化连续脱羧过程降解 Cu(II)-EDTA。在紫外光照射下,通过配体到金属电荷转移(LMCT),Cu(II)在 Cl 攻击络合的 Cu(II)的光解过程中生成 Cu(I)。自由和有机配体络合的 Cu(I)都可以与 ClO 形成二元/三元配合物,通过金属到配体电荷转移(MLCT)将其氧化回 Cu(II),同时产生 Cl,从而对 Cu(II)-EDTA 的去除产生自动催化作用。考察了氯剂量和 pH 值的影响,并通过实际电镀废水和其他 Cu(II)-有机络合物验证了该技术的实用性。该研究揭示了 Cl 脱络合的新机制,拓宽了有前途的 UV/氯工艺在水处理中的应用。

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