柔性基板上金属电极的电气可靠性及弯曲测试方法

Electrical Reliability and Bending Test Methodologies of Metal Electrode on Flexible Substrate.

作者信息

Kim Byoung-Joo, Park Young-Bae, Joo Young-Chang

机构信息

Materials Research Centre for Energy and Clean Technology, Department of Materials Science and Engineering, Andong National University, Andong 36729, Republic of Korea.

Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea.

出版信息

J Nanosci Nanotechnol. 2020 Jan 1;20(1):470-477. doi: 10.1166/jnn.2020.17226.

DOI:10.1166/jnn.2020.17226

PMID:31383195

Abstract

To develop highly reliable flexible electronics, mechanical reliability during mechanical deformation such as repeated bending is an important issue. Bending test methodologies to estimate long-term reliability during repeated mechanical deformation are attracting substantial interest from related researchers and industry insiders. In this study, four representative bending test methodologies for testing flexible electronics are introduced: free arc bending test, variable radius bending test, sliding plate test, and variable angle test. Correct name and characteristics of each method are also explained. Furthermore, electrical reliability of Cu film on polymer substrate samples was investigated in each bending test method through monitoring of electrical resistance. With different bending test methodologies, different electrical resistance changes were observed. Fatigue damages occurred at different areas. Obtained electrical reliability and failure modes were analyzed by observing crack morphologies.

摘要

为了开发高度可靠的柔性电子产品，在诸如反复弯曲等机械变形过程中的机械可靠性是一个重要问题。用于评估反复机械变形过程中长期可靠性的弯曲测试方法正吸引着相关研究人员和业内人士的广泛关注。在本研究中，介绍了四种用于测试柔性电子产品的代表性弯曲测试方法：自由弧弯曲测试、可变半径弯曲测试、滑板测试和可变角度测试。还解释了每种方法的正确名称和特点。此外，通过监测电阻，在每种弯曲测试方法中研究了聚合物基板样品上铜膜的电气可靠性。采用不同的弯曲测试方法时，观察到了不同的电阻变化。疲劳损伤发生在不同区域。通过观察裂纹形态分析了获得的电气可靠性和失效模式。