State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China. Flexible Printed Electronics Technology Center, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China.
Nanotechnology. 2019 Dec 13;30(50):505303. doi: 10.1088/1361-6528/ab437a. Epub 2019 Sep 11.
Ultralow-temperature sintering plays a vital role in the development of flexible printed electronics, which improves flexibility and reduces energy consumption. This study investigates the ultralow-temperature sintering of large-sized silver nanoparticles (Ag NPs) by laser modification of the substrate surface. Ag NPs in conductive ink were sintered at only 60 °C. Designing the appropriate size of modified regions, the sintered Ag layer exhibits a sheet resistance of only 0.274 Ω and withstands 10 000 folding cycles. Energy-dispersive x-ray spectroscopy showed that TiO formed by laser ablation promotes the sintering of Ag NPs and joining with the substrate. A paper-based flexible integrated circuit board was also prepared.
超低温烧结在柔性印刷电子产品的发展中起着至关重要的作用，它提高了柔韧性并降低了能耗。本研究通过激光对基底表面进行改性来实现大尺寸银纳米粒子（Ag NPs）的超低温烧结。在 60°C 下烧结导电油墨中的 Ag NPs。通过设计适当尺寸的改性区域，烧结后的 Ag 层的方阻仅为 0.274 Ω，并且可以承受 10000 次折叠循环。能谱分析表明，激光烧蚀形成的 TiO 促进了 Ag NPs 的烧结并与基底结合。还制备了基于纸张的柔性集成电路板。
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