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过冷凝固冷却曲线的再辉度率。

The recalescence rate of cooling curve for undercooled solidification.

作者信息

Xu Junfeng, Yang Tian, Li Zhuo, Wang Xiao, Xiao Ying, Jian Zengyun

机构信息

The Shaanxi Key Laboratory of Photoelectric Functional Materials and Devices, Xi'an Technological University, Xi'an, Shaanxi, 710021, P.R. China.

出版信息

Sci Rep. 2020 Jan 28;10(1):1380. doi: 10.1038/s41598-019-56079-6.

Abstract

Recalescence rate (R) in cooling curve is well known that affected by undercooling in solidification, but the accurate relationship of them is not clear yet. In this paper, based on the undercooled solidification of Fe-B alloy, the factor affected on recalescence process was investigated. The relationship R = VΔT/D was first found, where V is the growth velocity, ΔT the recalescence degree (approximate the undercooling), D the focus region diameter dependent on the distance of the pyrometer. With this result the solidification interface growth velocity can be predicted from recalescence of cooling curve, vice versa. In addition, an approximate relation between growth velocity and the size of the critical nucleus was shown.

摘要

冷却曲线中的再辉率(R)受凝固过冷度的影响是众所周知的,但它们之间的确切关系尚不清楚。本文基于Fe-B合金的过冷凝固,研究了影响再辉过程的因素。首次发现了R = VΔT/D的关系,其中V是生长速度,ΔT是再辉度(近似过冷度),D是取决于高温计距离的聚焦区域直径。根据这一结果,可以从冷却曲线的再辉预测凝固界面的生长速度,反之亦然。此外,还给出了生长速度与临界晶核尺寸之间的近似关系。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/e81f/6987091/8babf25d49cf/41598_2019_56079_Fig1_HTML.jpg

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