Zhang Ding-Jun, Dong Li, Li Yong-Tong, Wu Yanfei, Ma Ying-Xia, Yang Bin
State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metals, Lanzhou University of Technology, Lanzhou 730050, China.
Waste Manag. 2018 Aug;78:191-197. doi: 10.1016/j.wasman.2018.05.036. Epub 2018 May 29.
In this study, using several types of acidic ionic liquids as the leaching reagents, the leaching behaviors of the copper present in waste printed circuit boards (WPCBs) were investigated. The effects of various parameters on the copper leaching rate were studied, such as the particle size of the shredded WPCB, type of ionic liquid used, hydrogen peroxide dosage, solid-to-liquid ratio, leaching temperature, and leaching time. The experimental results showed that the copper leaching rate increases continuously when the powder particle size is increased from 0.071 to 0.500 mm. Moreover, the copper leaching rate also increases with an increase in the leaching temperature. In contrast, the leaching rate first increases and then decreases with increases in the leaching time, hydrogen peroxide dosage, and solid-to-liquid ratio. The optimal conditions that provided a 98.31% copper leaching rate were: particle size >0.500 mm, 8.5 mL 90% (v/v) ionic liquid, 1.5 mL 30% hydrogen peroxide, solid-to-liquid ratio of 1/20, leaching temperature of 80 °C, and leaching time of 2 h.
在本研究中，使用几种类型的酸性离子液体作为浸出剂，研究了废印刷电路板（WPCBs）中铜的浸出行为。研究了各种参数对铜浸出率的影响，如粉碎后的WPCB的粒径、所用离子液体的类型、过氧化氢用量、固液比、浸出温度和浸出时间。实验结果表明，当粉末粒径从0.071毫米增加到0.500毫米时，铜浸出率持续增加。此外，铜浸出率也随着浸出温度的升高而增加。相比之下，浸出率随着浸出时间、过氧化氢用量和固液比的增加先增加后降低。实现98.31%铜浸出率的最佳条件为：粒径>0.500毫米、8.5毫升90%（v/v）离子液体、1.5毫升30%过氧化氢、固液比1/20、浸出温度80°C和浸出时间2小时。
