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使用有机硅基大分子偶氮引发剂引入硅氧烷嵌段提高丙烯酸类压敏胶粘剂的耐热性

Enhanced Heat Resistance of Acrylic Pressure-Sensitive Adhesive by Incorporating Silicone Blocks Using Silicone-Based Macro-Azo-Initiator.

作者信息

Park Hee-Woong, Seo Hyun-Su, Kwon Kiok, Lee Jung-Hyun, Shin Seunghan

机构信息

Green Chemistry & Materials Group, Korea Institute of Industrial Technology (KITECH), Cheonan 31056, Korea.

Department of Chemical and Biological Engineering, Korea University, Seoul 02841, Korea.

出版信息

Polymers (Basel). 2020 Oct 19;12(10):2410. doi: 10.3390/polym12102410.

Abstract

To improve the heat resistance of acrylic-based pressure-sensitive adhesive (PSA), silicone-block-containing acrylic PSAs (SPSAs) were synthesized using a polydimethylsiloxane (PDMS)-based macro-azo-initiator (MAI). To evaluate the heat resistance of the PSA films, the probe tack and 90° peel strength were measured at different temperatures. The acrylic PSA showed that its tack curves changed from balanced debonding at 25 °C to cohesive debonding at 50 °C and exhibited a sharp decrease. However, in the case of SPSA containing 20 wt% MAI (MAI20), the balanced debonding was maintained at 75 °C, and its tack value hardly changed with temperature. As the MAI content increased, the peel strength at 25 °C decreased due to the microphase separation between PDMS- and acryl-blocks in SPSA, but the shear adhesion failure temperature (SAFT) increased almost linearly from 41.3 to 122.8 °C. Unlike stainless steel substrate, SPSA showed improved peel strength on a polypropylene substrate due to its low surface energy caused by PDMS block. Owing to the addition of 20 wt% silicone-urethane dimethacrylate oligomer and 200 mJ/cm UV irradiation dose, MAI20 showed significantly increased 90° peel strength at 25 °C (548.3 vs. 322.4 gf/25 mm for pristine MAI20). Its heat resistance under shear stress assessed by shear adhesion failure test (SAFT) exhibited raising in failure temperature to 177.3 °C when compared to non-irradiated sample.

摘要

为提高丙烯酸类压敏胶粘剂(PSA)的耐热性,使用基于聚二甲基硅氧烷(PDMS)的大分子偶氮引发剂(MAI)合成了含硅氧烷嵌段的丙烯酸类PSA(SPSA)。为评估PSA薄膜的耐热性,在不同温度下测量了探针粘性和90°剥离强度。丙烯酸类PSA显示其粘性曲线从25℃时的平衡脱粘变为50℃时的内聚脱粘,并呈现出急剧下降。然而,对于含有20 wt% MAI(MAI20)的SPSA,平衡脱粘在75℃时得以保持,其粘性值几乎不随温度变化。随着MAI含量的增加,由于SPSA中PDMS嵌段和丙烯酸嵌段之间的微相分离,25℃时的剥离强度降低,但剪切粘附失效温度(SAFT)从41.3℃几乎线性增加到122.8℃。与不锈钢基材不同,由于PDMS嵌段导致的低表面能,SPSA在聚丙烯基材上显示出提高的剥离强度。由于添加了20 wt%的硅氧烷 - 聚氨酯二甲基丙烯酸酯低聚物和200 mJ/cm的紫外线辐照剂量,MAI20在25℃时的90°剥离强度显著增加(原始MAI20为322.4 gf/25 mm,MAI20为548.3 gf/25 mm)。通过剪切粘附失效试验(SAFT)评估,其在剪切应力下的耐热性显示,与未辐照样品相比,失效温度提高到了177.3℃。

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